(19)
(11) EP 1 665 345 A2

(12)

(88) Date of publication A3:
30.06.2005

(43) Date of publication:
07.06.2006 Bulletin 2006/23

(21) Application number: 04784992.2

(22) Date of filing: 24.09.2004
(51) International Patent Classification (IPC): 
H01L 21/00(1974.07)
(86) International application number:
PCT/US2004/031398
(87) International publication number:
WO 2005/031812 (07.04.2005 Gazette 2005/14)
(84) Designated Contracting States:
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PL PT RO SE SI SK TR

(30) Priority: 26.09.2003 US 672416

(71) Applicant: Rockwell Scientific Licensing LLC
Thousand Oaks, California 91358-0085 (US)

(72) Inventors:
  • TENCH, Morgan, D.
    Camarillo, CA 93010 (US)
  • WHITE, John, T.
    Lancaster, CA 93536 (US)

(74) Representative: Crawford, Andrew Birkby et al
A.A. Thornton & Co. 235 High Holborn
GB-London WC1V 7LE
GB-London WC1V 7LE (GB)

   


(54) IMPROVED COPPER BATH FOR ELECTROPLATING FINE CIRCUITRY ON SEMICONDUCTOR CHIPS