APPARATUS TO IMPROVE WAFER TEMPERATURE UNIFORMITY FOR FACE-UP WET PROCESSING - Patent 1676295

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EP 1 676 295 A2

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(88)	Date of publication A3:
	09.06.2005

(43)	Date of publication:
	05.07.2006 Bulletin 2006/27

(21)	Application number: 04794284.2

(22)	Date of filing: 05.10.2004

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International Patent Classification (IPC):

H01L 21/00^(1974.07)
C23C 18/16^(1985.01)

C23C 16/458^(2000.01)

(86)	International application number:
	PCT/US2004/032879

(87)	International publication number:
	WO 2005/036615 (21.04.2005 Gazette 2005/16)

(84)	Designated Contracting States:
	AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PL PT RO SE SI SK TR

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Priority:

06.10.2003 US 680359
06.10.2003 US 680325

(71)	Applicant: APPLIED MATERIALS, INC.
	Santa Clara, California 95054 (US)

(72)	Inventors:
	PANCHAM , Ian, A. San Francisco, CA 94110 (US) NGUYEN, Son, T. San Jose, CA 95136 (US) ROSEN, Gary, J. San Carlos, CA 94070 (US)

(74)	Representative: Bayliss, Geoffrey Cyril
	BOULT WADE TENNANT, Verulam Gardens 70 Gray's Inn Road London WC1X 8BT London WC1X 8BT (GB)

(54)	APPARATUS TO IMPROVE WAFER TEMPERATURE UNIFORMITY FOR FACE-UP WET PROCESSING