DISPENSE GEOMETRY AND CONDUCTIVE TEMPLATE TO ACHIEVE HIGH-SPEED FILLING AND THROUGHPUT

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EP 1 682 340 A2

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(88)	Date of publication A3:
	02.02.2006

(43)	Date of publication:
	26.07.2006 Bulletin 2006/30

(21)	Application number: 04818716.5

(22)	Date of filing: 05.11.2004

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International Patent Classification (IPC):

B32B 3/10^(2006.01)
B32B 33/00^(2006.01)
B05D 1/26^(2006.01)
B05D 3/06^(2006.01)
B05D 3/14^(2006.01)
C23C 22/82^(2006.01)
C08J 7/18^(2006.01)

B32B 3/30^(2006.01)
B05D 1/02^(2006.01)
B05D 1/40^(2006.01)
B05D 3/12^(2006.01)
B05D 7/24^(2006.01)
C08F 2/46^(2006.01)

(86)	International application number:
	PCT/US2004/038088

(87)	International publication number:
	WO 2005/047975 (26.05.2005 Gazette 2005/21)

(84)	Designated Contracting States:
	AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LU MC NL PL PT RO SE SI SK TR
	Designated Extension States:
	AL HR LT LV MK YU

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Priority:

12.11.2003 US 706537
14.11.2003 US 714088

(71)	Applicant: MOLECULAR IMPRINTS, INC.
	Austin, TX 78758-3605 (US)

(72)	Inventors:
	SREENIVASAN, Sidlgata V. Austin, Texas 78750 (US) MCMACKIN, Ian M. Austin, Texas 78731 (US) CHOI, Byung-Jin Austin, Texas 78750 (US) VOISIN, Ronald D. Austin, Texas 78759 (US)

(74)	Representative: Kirschner, Klaus Dieter
	advotec. Böck, Tappe, Kirschner Patent- und Rechtsanwälte Sollner Strasse 38 81479 München 81479 München (DE)

(54)	DISPENSE GEOMETRY AND CONDUCTIVE TEMPLATE TO ACHIEVE HIGH-SPEED FILLING AND THROUGHPUT