(19)
(11)
EP 1 683 209 A2
(12)
(88)
Date of publication A3:
28.07.2005
(43)
Date of publication:
26.07.2006
Bulletin 2006/30
(21)
Application number:
04800977.3
(22)
Date of filing:
10.11.2004
(51)
International Patent Classification (IPC):
H01L
51/10
(2006.01)
H01L
23/10
(2006.01)
H01L
23/26
(2006.01)
H01L
21/50
(2006.01)
(86)
International application number:
PCT/US2004/037597
(87)
International publication number:
WO 2005/050751
(
02.06.2005
Gazette 2005/22)
(84)
Designated Contracting States:
DE FR GB NL
(30)
Priority:
12.11.2003
US 519139 P
15.10.2004
US 619222 P
(71)
Applicant:
E.I. DUPONT DE NEMOURS AND COMPANY
Wilmington, Delaware 19898 (US)
(72)
Inventors:
TREMEL, James, Daniel
Santa Barbara, CA 93105 (US)
HUBERT, Matthew, Dewey
Columbia, SC 29210 (US)
(74)
Representative:
Hughes, Andrea Michelle
Frank B. Dehn & Co. St Bride's House 10 Salisbury Square
London EC4Y 8JD
London EC4Y 8JD (GB)
(54)
ENCAPSULATION ASSEMBLY FOR ELECTRONIC DEVICES