(19)
(11) EP 1 683 209 A2

(12)

(88) Date of publication A3:
28.07.2005

(43) Date of publication:
26.07.2006 Bulletin 2006/30

(21) Application number: 04800977.3

(22) Date of filing: 10.11.2004
(51) International Patent Classification (IPC): 
H01L 51/10(2006.01)
H01L 23/10(2006.01)
H01L 23/26(2006.01)
H01L 21/50(2006.01)
(86) International application number:
PCT/US2004/037597
(87) International publication number:
WO 2005/050751 (02.06.2005 Gazette 2005/22)
(84) Designated Contracting States:
DE FR GB NL

(30) Priority: 12.11.2003 US 519139 P
15.10.2004 US 619222 P

(71) Applicant: E.I. DUPONT DE NEMOURS AND COMPANY
Wilmington, Delaware 19898 (US)

(72) Inventors:
  • TREMEL, James, Daniel
    Santa Barbara, CA 93105 (US)
  • HUBERT, Matthew, Dewey
    Columbia, SC 29210 (US)

(74) Representative: Hughes, Andrea Michelle 
Frank B. Dehn & Co. St Bride's House 10 Salisbury Square
London EC4Y 8JD
London EC4Y 8JD (GB)

   


(54) ENCAPSULATION ASSEMBLY FOR ELECTRONIC DEVICES