<?xml version="1.0" encoding="UTF-8"?>
<!DOCTYPE ep-patent-document PUBLIC "-//EPO//EP PATENT DOCUMENT 1.1//EN" "ep-patent-document-v1-1.dtd">
<ep-patent-document id="EP06000077A3" file="EP06000077NWA3.xml" lang="en" country="EP" doc-number="1688923" kind="A3" date-publ="20071107" status="n" dtd-version="ep-patent-document-v1-1">
<SDOBI lang="en"><B000><eptags><B001EP>ATBECHDEDKESFRGBGRITLILUNLSEMCPTIESILTLVFIROMKCYALTRBGCZEEHUPLSKBAHRISYU........</B001EP><B005EP>J</B005EP><B007EP>DIM360 (Ver 1.5  21 Nov 2005) -  1620000/0</B007EP></eptags></B000><B100><B110>1688923</B110><B120><B121>EUROPEAN PATENT APPLICATION</B121></B120><B130>A3</B130><B140><date>20071107</date></B140><B190>EP</B190></B100><B200><B210>06000077.5</B210><B220><date>20060103</date></B220><B250>en</B250><B251EP>en</B251EP><B260>en</B260></B200><B300><B310>48406</B310><B320><date>20050201</date></B320><B330><ctry>US</ctry></B330></B300><B400><B405><date>20071107</date><bnum>200745</bnum></B405><B430><date>20060809</date><bnum>200632</bnum></B430></B400><B500><B510EP><classification-ipcr sequence="1"><text>G11B   5/39        20060101AFI20060531BHEP        </text></classification-ipcr><classification-ipcr sequence="2"><text>H01L  43/08        20060101ALI20060531BHEP        </text></classification-ipcr><classification-ipcr sequence="3"><text>H01F  10/12        20060101ALI20060531BHEP        </text></classification-ipcr></B510EP><B540><B541>de</B541><B542>Verfahren zur Erhöhung der Kopplungskraft eines Sensors und Sensor für einen Lesekopf</B542><B541>en</B541><B542>Method for increasing the coupling strength of a sensor and sensor for a reading head</B542><B541>fr</B541><B542>Procédé pour augmenter la densité de couplage d'un capteur et capteur pour une tête de lecture</B542></B540><B590><B598>1</B598></B590></B500><B700><B710><B711><snm>Hitachi Global Storage Technologies Netherlands 
B.V.</snm><iid>04531890</iid><irf>78221 (KI/SC)</irf><adr><str>Locatellikade 1</str><city>1076 AZ  Amsterdam</city><ctry>NL</ctry></adr></B711></B710><B720><B721><snm>Lee, Wen-Yaung</snm><adr><str>1171 Valley Quail Circle</str><city>San Jose, CA 95120</city><ctry>US</ctry></adr></B721><B721><snm>Mauri, Daniele</snm><adr><str>1163 Scarsdale Court</str><city>San Jose, CA 95120</city><ctry>US</ctry></adr></B721><B721><snm>Li, Jinshan</snm><adr><str>6065 Whitehaven Court</str><city>San Jose, CA 95138</city><ctry>US</ctry></adr></B721><B721><snm>Nishioka, Koichi</snm><adr><str>4-7-605 Nishiki-cho</str><city>Hiratsuka-shi
Kanagawa-ken 254-0044</city><ctry>JP</ctry></adr></B721></B720><B740><B741><snm>Kirschner, Klaus Dieter</snm><sfx>et al</sfx><iid>09237481</iid><adr><str>Kirschner Patentanwaltskanzlei 
Sollner Strasse 38</str><city>81479 München</city><ctry>DE</ctry></adr></B741></B740></B700><B800><B840><ctry>AT</ctry><ctry>BE</ctry><ctry>BG</ctry><ctry>CH</ctry><ctry>CY</ctry><ctry>CZ</ctry><ctry>DE</ctry><ctry>DK</ctry><ctry>EE</ctry><ctry>ES</ctry><ctry>FI</ctry><ctry>FR</ctry><ctry>GB</ctry><ctry>GR</ctry><ctry>HU</ctry><ctry>IE</ctry><ctry>IS</ctry><ctry>IT</ctry><ctry>LI</ctry><ctry>LT</ctry><ctry>LU</ctry><ctry>LV</ctry><ctry>MC</ctry><ctry>NL</ctry><ctry>PL</ctry><ctry>PT</ctry><ctry>RO</ctry><ctry>SE</ctry><ctry>SI</ctry><ctry>SK</ctry><ctry>TR</ctry></B840><B844EP><B845EP><ctry>AL</ctry></B845EP><B845EP><ctry>BA</ctry></B845EP><B845EP><ctry>HR</ctry></B845EP><B845EP><ctry>MK</ctry></B845EP><B845EP><ctry>YU</ctry></B845EP></B844EP><B880><date>20071107</date><bnum>200745</bnum></B880></B800></SDOBI>
<abstract id="abst" lang="en">
<p id="pa01" num="0001">An anti-parallel pinned sensor is provided with a spacer that increases the anti-parallel coupling strength of the sensor. The anti-parallel pinned sensor is a GMR or TMR sensor having a pure ruthenium or ruthenium alloy spacer. The thickness of the spacer is less than 0.8 nm, preferably between 0.1 and 0.6 nm. The spacer is also annealed in a magnetic field that is 1.5 Tesla or higher, and preferably greater than 5 Tesla. This design yields unexpected results by more than tripling the pinning field over that of typical AP-pinned GMR and TMR sensors that utilize ruthenium spacers which are 0.8 nm thick and annealed in a relatively low magnetic field of approximately 1.3 Tesla.
<img id="iaf01" file="imgaf001.tif" wi="78" he="102" img-content="drawing" img-format="tif"/></p>
</abstract>
<search-report-data id="srep" lang="en" srep-office="EP" date-produced=""><doc-page id="srep0001" file="srep0001.tif" wi="152" he="233" type="tif"/><doc-page id="srep0002" file="srep0002.tif" wi="154" he="233" type="tif"/></search-report-data>
</ep-patent-document>
