(19)
(11) EP 1 692 926 A1

(12)

(43) Date of publication:
23.08.2006 Bulletin 2006/34

(21) Application number: 04805147.8

(22) Date of filing: 09.12.2004
(51) International Patent Classification (IPC): 
H05K 9/00(2006.01)
(86) International application number:
PCT/FI2004/000752
(87) International publication number:
WO 2005/057999 (23.06.2005 Gazette 2005/25)
(84) Designated Contracting States:
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU MC NL PL PT RO SE SI SK TR

(30) Priority: 09.12.2003 FI 20031796

(71) Applicant: Aspocomp Technology Oy
01510 Vantaa (FI)

(72) Inventor:
  • MUUKKONEN, Esa
    FI-00840 Helsinki (FI)

(74) Representative: Knuth-Lehtola, Sisko Hillevi 
Seppo Laine Oy, Itämerenkatu 3 B
00180 Helsinki
00180 Helsinki (FI)

   


(54) METHOD FOR CONSTRUCTING EMI SHIELDING AROUND A COMPONENT EMBEDDED IN A CIRCUIT BOARD