(19)
(11) EP 1 693 785 A8

(12) CORRECTED EUROPEAN PATENT APPLICATION
published in accordance with Art. 158(3) EPC

(15) Correction information:
Corrected version no 1 (W1 A1)

(48) Corrigendum issued on:
13.12.2006 Bulletin 2006/50

(43) Date of publication:
23.08.2006 Bulletin 2006/34

(21) Application number: 04820194.1

(22) Date of filing: 07.12.2004
(51) International Patent Classification (IPC): 
G06K 19/00(2006.01)
 D21H 21/42(2006.01)
(86) International application number:
PCT/JP2004/018188
(87) International publication number:
WO 2005/057479 (23.06.2005 Gazette 2005/25)
(84) Designated Contracting States:
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU MC NL PL PT RO SE SI SK TR

(30) Priority: 10.12.2003 JP 2003411762
14.09.2004 JP 2004267161

(71) Applicants:
  • OJI PAPER CO., LTD.
    Tokyo 104-0061 (JP)
  • Fec Co., Ltd.
    Ishikawa-ken (JP)
  • Oji Specialty Paper Co., Ltd.
    Tokyo 1040061 (JP)

(72) Inventors:
  • AYAKI, Mitsuhiro
    Tokyo 1040061 (JP)
  • KANDA, Nobuo
    Tokyo 1040061 (JP)
  • TOMITA, Keitaro
    Tokyo 1040061 (JP)
  • OZAKI, Tuyoshi
    Tokyo 1040061 (JP)
  • SUGIMURA, Shiro
    Kanazawa-shi, Ishikawa 9200377 (JP)
  • KOBAYASHI, Hideki
    Kanazawa-shi, Ishikawa 9200377 (JP)

(74) Representative: Haines, Miles John L.S. et al
D Young & Co 120 Holborn
London EC1N 2DY
London EC1N 2DY (GB)

   


(54) TAPE WITH EMBEDDED IC CHIP AND SHEET WITH EMBEDDED IC CHIP


(57) A sheet with a built-in IC chip in which mechanical external forces do not significantly impinge on the IC chip and the IC chip does not separate or become damaged, and a tape with a built-in IC chip used for the sheet with a built-in IC chip. In the tape with a built-in IC chip, a part or all of the IC chip is embedded in a tape body.