(19)
(11) EP 1 717 352 A3

(12) EUROPEAN PATENT APPLICATION

(88) Date of publication A3:
17.01.2007 Bulletin 2007/03

(43) Date of publication A2:
02.11.2006 Bulletin 2006/44

(21) Application number: 06005414.5

(22) Date of filing: 16.03.2006
(51) International Patent Classification (IPC): 
C25D 7/12(2006.01)
 C25D 17/00(2006.01)
(84) Designated Contracting States:
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
Designated Extension States:
AL BA HR MK YU

(30) Priority: 22.04.2005 JP 2005125538

(71) Applicant: YAMAMOTO-MS Co., Ltd.
Tokyo (JP)

(72) Inventors:
  • Yamamoto, Wataru, Yamamoto-Ms Co, Ltd
    Shibuya-ku Tokyo (JP)
  • Akiyama, Katsunori, Yamamoto-Ms Co, Ltd
    Shibuya-ku Tokyo (JP)
  • Katsumoto, Tokiko, Yamamoto-Ms Co, Ltd
    Shibuya-ku Tokyo (JP)

(74) Representative: Strehl Schübel-Hopf & Partner 
Maximilianstrasse 54
80538 München
80538 München (DE)

   


(54) Electroplating apparatus


(57) An electroplating apparatus is provided which includes a solution tank which has at least a bottom plate and a side plate and inside which electroplating solution is poured and a cathode plate and an anode plate which are horizontally placed so as to face each other in the electroplating solution in the solution tank, in which one plate of the cathode plate and the anode plate is an object to be electroplated and placed in a lower position than the other plate, in which an opening through which the cathode plate and the anode plate are inserted into the solution tank is provided in the side plate of the solution tank, and in which a shield plate which is detachable shields the opening of the solution tank.







Search report