METHOD AND EQUIPMENT FOR INSPECTING MOUNTING ACCURACY OF COMPONENT

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(11)

EP 1 727 416 A8

(12)	CORRECTED EUROPEAN PATENT APPLICATION
	published in accordance with Art. 158(3) EPC

(15)	Correction information:
	Corrected version no 1 (W1 A1)

(48)	Corrigendum issued on:
	21.02.2007 Bulletin 2007/08

(43)	Date of publication:
	29.11.2006 Bulletin 2006/48

(21)	Application number: 05720241.8

(22)	Date of filing: 08.03.2005

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International Patent Classification (IPC):

H05K 13/08^(2006.01)

(86)	International application number:
	PCT/JP2005/003969

(87)	International publication number:
	WO 2005/089036 (22.09.2005 Gazette 2005/38)

(84)	Designated Contracting States:
	DE GB

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Priority:

15.03.2004 JP 2004072174

(71)	Applicant: Matsushita Electric Industrial Co., Ltd.
	Kadoma-shi Osaka 571-8501 (JP)

(72)	Inventor:
	SAKAI, Kazunobu Nakakoma-gun, Yamanashi 409-3803 (JP)

(74)	Representative: Eisenführ, Speiser & Partner
	Patentanwälte Rechtsanwälte Postfach 10 60 78 28060 Bremen 28060 Bremen (DE)

(54)	METHOD AND EQUIPMENT FOR INSPECTING MOUNTING ACCURACY OF COMPONENT

(57) A component is mounted in a component mounting position on a component mounting-side surface of an inspection-use board which is formed from a light transmitting material and which has a reflecting surface disposed on a surface opposed to the component mounting side-surface in a state of facing the component mounting side-surface, light is applied to the component mounting-side surface of the inspection-use board, the applied light is transmitted through the component mounting-side surface and reflected on the reflecting surface so that an image of an outline of the component formed by reflected light coming from around the component through the component mounting-side surface is picked up, and a component mounting accuracy is calculated based on the image.