(19)
(11) EP 1 732 116 A3

(12) EUROPEAN PATENT APPLICATION

(88) Date of publication A3:
11.04.2007 Bulletin 2007/15

(43) Date of publication A2:
13.12.2006 Bulletin 2006/50

(21) Application number: 06114933.2

(22) Date of filing: 02.06.2006
(51) International Patent Classification (IPC): 
H01L 21/48(2006.01)
 H01L 21/60(2006.01)
(84) Designated Contracting States:
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
Designated Extension States:
AL BA HR MK YU

(30) Priority: 08.06.2005 US 688994 P

(71) Applicant: Interuniversitair Micro-Elektronica Centrum (IMEC)
3001 Heverlee (BE)

(72) Inventors:
  • Beyne, Eric
    3001, LEUVEN (BE)
  • Labie, Riet
    3010, KESSEL-LO (BE)

(74) Representative: pronovem 
Office Van Malderen Avenue Josse Goffin 158
1082 Bruxelles
1082 Bruxelles (BE)

   


(54) Methods for bonding and micro-electronic devices produced according to such methods


(57) The present invention is related to a method of bonding two elements comprising:
- producing on a first element (1) a first micropattern (2), comprising a first metal layer
- producing on a second element (3) a second micropattern (4), comprising a second metal layer;
- applying onto said first micropattern and/or on said second micropattern a layer (5) of solder material;
- joining the first micropattern and the second micropattern by means of a thermocompression or reflow method,

characterized in that the method further comprises the step of producing on at least one element a patterned non-conductive adhesive layer (10) around the micropattern on said element, said adhesive layer being applied before said joining step, so that after the joining step, the elements are secured to each other by said adhesive layer(s).







Search report