(19)
(11) EP 1 736 295 A8

(12) CORRECTED EUROPEAN PATENT APPLICATION
published in accordance with Art. 158(3) EPC

(15) Correction information:
Corrected version no 1 (W1 A1)

(48) Corrigendum issued on:
28.02.2007 Bulletin 2007/09

(43) Date of publication:
27.12.2006 Bulletin 2006/52

(21) Application number: 05730433.9

(22) Date of filing: 13.04.2005
(51) International Patent Classification (IPC): 
B29C 45/70(2006.01)
H01M 8/02(2006.01)
B29K 105/16(2006.01)
B29L 31/34(2006.01)
 B29C 45/26(2006.01)
B29K 81/00(2006.01)
B29K 507/04(2006.01)
(86) International application number:
PCT/JP2005/007148
(87) International publication number:
WO 2005/099994 (27.10.2005 Gazette 2005/43)
(84) Designated Contracting States:
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU MC NL PL PT RO SE SI SK TR

(30) Priority: 15.04.2004 JP 2004120449

(71) Applicant: IDEMITSU KOSAN CO., LTD.
Tokyo 100-8321 (JP)

(72) Inventors:
  • TANAKA, Takayoshi
    Ichihara-shi, Chiba 2990193 (JP)
  • IGA, Toru
    Ichihara-shi, Chiba 2990193 (JP)
  • AE, Haruhiko
    Ichihara-shi, Chiba 2990193 (JP)

(74) Representative: Gille Hrabal Struck Neidlein Prop Roos 
Brucknerstrasse 20
40593 Düsseldorf
40593 Düsseldorf (DE)

   


(54) METHOD FOR INJECTION COMPRESSION MOLDING OF CONDUCTIVE THERMOPLASTIC RESIN COMPOSITION


(57) An injection/compression molding method comprising the steps of: a injection filling step for injection filling a conductive thermoplastic resin composition containing a conductive filler at a ratio of 70 to 95 mass% into a cavity space 13 with the interval in the range of 0.5 to 5.0 mm formed by mating faces 11a, 12a of dies 11, 12 each having a temperature in the range of 150 to 250 °C; and a compression forming step for compression forming, after the filling step is finished and the die space was closed, the conductive thermoplastic resin composition filled in said space at the compression speed in the range of 1.0 to 20 mm/sec with the compression pressure of 10 MPa or higher. As obtained molded product contains the conductive filler homogeneously distributed at a high content ratio, so that the molded product can be applied to, for instance, a separator for a fuel cell.