LIGHT BEAM BONDING - Patent 1737086

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(11)

EP 1 737 086 A8

(12)	CORRECTED EUROPEAN PATENT APPLICATION
	published in accordance with Art. 158(3) EPC

(15)	Correction information:
	Corrected version no 1 (W1 A1)

(48)	Corrigendum issued on:
	21.02.2007 Bulletin 2007/08

(43)	Date of publication:
	27.12.2006 Bulletin 2006/52

(21)	Application number: 05728835.9

(22)	Date of filing: 31.03.2005

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International Patent Classification (IPC):

H01R 43/02^(2006.01)

(86)	International application number:
	PCT/JP2005/006285

(87)	International publication number:
	WO 2005/096458 (13.10.2005 Gazette 2005/41)

(84)	Designated Contracting States:
	AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU MC NL PL PT RO SE SI SK TR

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Priority:

31.03.2004 JP 2004107905

(71)	Applicant: FCI
	78000 Versailles (FR)

(72)	Inventor:
	OKANO, Kazuya; Yokohama-shi, Kanagawa; 2400016 (JP)

(74)	Representative: Cabinet Plasseraud
	52 rue de la Victoire 75440 Paris Cedex 09 75440 Paris Cedex 09 (FR)

(54)	LIGHT BEAM BONDING

(57) A method for performing soldering using a light beam, and a mask for blocking the light beam are provided. A connecting method is provided, being a method for connecting conducting lines and contacts using a light beam, including a step for installing conducting lines in regions wherein contacts are formed, a step for supplying solder to regions wherein contacts are formed, a step for installing a mask that shields at least a portion of the contacts from a light beam, and a step for connecting conducting lines and contacts by melting solder by illuminating with a light beam.