(19)
(11) EP 1 737 285 A3

(12) EUROPEAN PATENT APPLICATION

(88) Date of publication A3:
04.06.2008 Bulletin 2008/23

(43) Date of publication A2:
27.12.2006 Bulletin 2006/52

(21) Application number: 06012740.4

(22) Date of filing: 21.06.2006
(51) International Patent Classification (IPC): 
H05K 3/12(2006.01)
(84) Designated Contracting States:
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
Designated Extension States:
AL BA HR MK RS

(30) Priority: 22.06.2005 JP 2005181622

(71) Applicant: CANON KABUSHIKI KAISHA
Ohta-ku, Tokyo (JP)

(72) Inventors:
  • Mori, Takashi Canon K.K.
    Ohta-ku Tokyo (JP)
  • Tsuruoka, Yuji Canon K.K.
    Ohta-ku Tokyo (JP)
  • Furukawa, Masao Canon K.K.
    Ohta-ku Tokyo (JP)
  • Kamiya, Seiichi Canon K.K.
    Ohta-ku Tokyo (JP)
  • Yamaguchi, Nobuhito Canon K.K.
    Ohta-ku Tokyo (JP)

(74) Representative: Weser, Wolfgang 
Weser & Kollegen, Patentanwälte Radeckestrasse 43
81245 München
81245 München (DE)

   


(54) Circuit pattern forming method and circuit pattern forming device


(57) The present invention provides a circuit pattern forming device and a circuit pattern forming method both of which can eliminate problems, such as open circuits and short circuits, when forming circuit patterns on the substrate and which can form circuit patterns of a thin film uniform in thickness. To this end, the present invention forms liquid dots (12) on the substrate (1) with gaps (17) between the dots. Then, it further forms liquid dots between the liquid dots (12), thus forming a liquid circuit pattern. The circuit pattern is then solidified by a fixing step.







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