(19)
(11) EP 1 741 138 A1

(12)

(43) Date of publication:
10.01.2007 Bulletin 2007/02

(21) Application number: 05718632.2

(22) Date of filing: 04.04.2005
(51) International Patent Classification (IPC): 
H01L 25/065(2006.01)
(86) International application number:
PCT/IB2005/051110
(87) International publication number:
WO 2005/101502 (27.10.2005 Gazette 2005/43)
(84) Designated Contracting States:
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU MC NL PL PT RO SE SI SK TR

(30) Priority: 16.04.2004 EP 04300207

(71) Applicant: Koninklijke Philips Electronics N.V.
5621 BA Eindhoven (NL)

(72) Inventor:
  • COUSIN, Alain, c/o Société Civile SPID
    75008 PARIS (FR)

(74) Representative: Pennings, Johannes et al
NXP Semiconductors Intellectual Property Department High Tech Campus 60
5656 AG Eindhoven
5656 AG Eindhoven (NL)

   


(54) AN INTEGRATED CIRCUIT, A METHOD AND AN ASSEMBLY FOR MANUFACTURING THE INTEGRATED CIRCUIT, AND A MOBILE PHONE HAVING THE INTEGRATED CIRCUIT