(19)
(11)
EP 1 743 368 A1
(12)
(43)
Date of publication:
17.01.2007
Bulletin 2007/03
(21)
Application number:
04821957.0
(22)
Date of filing:
30.11.2004
(51)
International Patent Classification (IPC):
H01L
21/78
(2006.01)
(86)
International application number:
PCT/KR2004/003127
(87)
International publication number:
WO 2005/109492
(
17.11.2005
Gazette 2005/46)
(84)
Designated Contracting States:
DE NL
(30)
Priority:
07.05.2004
KR 2004032326
(71)
Applicant:
Hanmi Semiconductor Co., Ltd.
Incheon 404-250 (KR)
(72)
Inventors:
NA, Ik-Kyun, 202-1506, Jugong Apt.
Incheon 403-854 (KR)
KIM, Suk-Bae, 105-1103, Hankuk Apt.
Incheon 403-101 (KR)
CHOI, Seung-Hee, 101-104, Jugong Apt.
Incheon 405-850 (KR)
(74)
Representative:
Thun, Clemens
Mitscherlich & Partner Sonnenstrasse 33
80331 München
80331 München (DE)
(54)
SAWING AND HANDLER SYSTEM FOR MANUFACTURING SEMICONDUCTOR PACKAGE