(19)

(11)

EP 1 748 899 A2

(12)

(88) Date of publication A3: 02.02.2006 (43) Date of publication: 07.02.2007 Bulletin 2007/06 (21) Application number: 05755190.5 (22) Date of filing: 24.05.2005

(51) International Patent Classification (IPC):  B41M 5/00(2006.01) (86) International application number: PCT/US2005/018296 (87) International publication number: WO 2005/118303 (15.12.2005 Gazette 2005/50)

(84) Designated Contracting States: AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU MC NL PL PT RO SE SI SK TR (30) Priority: 26.05.2004 US 854350 19.04.2005 US 110106 (71) Applicant: Hewlett-Packard Development Company, L.P. Houston, TX 77070 (US)	(72) Inventors: BI, Yubai San Diego, CA 92127-1899 (US) CHEN, Tienteh San Diego, CA 92127-1899 (US) BURCH, Eric, Lee San Diego, CA 92127-1899 (US) BANGARU, Sandeep San Diego, CA 92127-1899 (US) ZAGARIAN, Kimberly San Diego, CA 92127-1899 (US) (74) Representative: Jehan, Robert et al Williams Powell Morley House 26-30 Holborn Viaduct London EC1A 2BP London EC1A 2BP (GB)