(19)
(11)
EP 1 756 328 A2
(12)
(88)
Date of publication A3:
06.04.2006
(43)
Date of publication:
28.02.2007
Bulletin 2007/09
(21)
Application number:
05763357.0
(22)
Date of filing:
15.06.2005
(51)
International Patent Classification (IPC):
C23C
16/00
(2006.01)
C23C
16/06
(2006.01)
(86)
International application number:
PCT/US2005/021291
(87)
International publication number:
WO 2005/124849
(
29.12.2005
Gazette 2005/52)
(84)
Designated Contracting States:
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU MC NL PL PT RO SE SI SK TR
(30)
Priority:
15.06.2004
US 869779
(71)
Applicant:
Aviza Technology, Inc.
Scotts Valley, CA 95066 (US)
(72)
Inventor:
SENZAKI, Yoshihide
Austin, TX 78741 (US)
(74)
Representative:
Dunlop, Brian Kenneth Charles et al
Wynne-Jones, Lainé & James 22 Rodney Road
Cheltenham Gloucestershire GL50 1JJ
Cheltenham Gloucestershire GL50 1JJ (GB)
(54)
SYSTEM AND METHOD FOR FORMING MULTI-COMPONENT DIELECTRIC FILMS