(19)
(11) EP 1 759 810 B8

(12) CORRECTED EUROPEAN PATENT SPECIFICATION
Note: Bibliography reflects the latest situation

(15) Correction information:
Corrected version no 1 (W1 B1)

(48) Corrigendum issued on:
18.11.2009 Bulletin 2009/47

(45) Mention of the grant of the patent:
07.10.2009 Bulletin 2009/41

(21) Application number: 06254557.9

(22) Date of filing: 31.08.2006
(51) International Patent Classification (IPC): 
B24B 37/04(2006.01)
 B24B 41/06(2006.01)

(54)

Wafer polishing method

Verfahren zum Polieren von Halbleiterscheiben

Méthode de polissage de plaquette

(84) Designated Contracting States:
DE FR GB NL

(30) Priority: 31.08.2005 JP 2005251026

(43) Date of publication of application:
07.03.2007 Bulletin 2007/10

(73) Proprietor: Shin-Etsu Chemical Co., Ltd.
Tokyo (JP)

(72) Inventors:
  • Murai, Toshinari c/o Shin-Etsu Chemical Co., Ltd.
    Joetsu-shi, Niigata-ken (JP)
  • Shibano, Yukio c/o Shin-Etsu Chemical Co., Ltd.
    Joetsu-shi, Niigata-ken (JP)

(74) Representative: Stoner, Gerard Patrick et al
Mewburn Ellis LLP 33 Gutter Lane
London EC2V 8AS
London EC2V 8AS (GB)


(56) References cited: : 
EP-A- 1 298 713
JP-A- 63 093 562
US-A- 5 906 532
 JP-A- 62 297 064
US-A- 4 466 852
   
       
    Note: Within nine months from the publication of the mention of the grant of the European patent, any person may give notice to the European Patent Office of opposition to the European patent granted. Notice of opposition shall be filed in a written reasoned statement. It shall not be deemed to have been filed until the opposition fee has been paid. (Art. 99(1) European Patent Convention).