(19)
(11) EP 1 766 673 A1

(12)

(43) Date of publication:
28.03.2007 Bulletin 2007/13

(21) Application number: 05766874.1

(22) Date of filing: 29.06.2005
(51) International Patent Classification (IPC): 
H01L 21/60(2006.01)
(86) International application number:
PCT/US2005/023041
(87) International publication number:
WO 2006/004809 (12.01.2006 Gazette 2006/02)
(84) Designated Contracting States:
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU MC NL PL PT RO SE SI SK TR

(30) Priority: 30.06.2004 US 584016 P

(71) Applicant: Unitive International Limited
Curacao (AN)

(72) Inventors:
  • MIS, J. Daniel
    Cary, North Carolina 27513 (US)
  • ADEMA, Gretchen M.
    Raleigh, North Carolina 27613 (US)
  • BUMGARNER, Susan
    Clearwater, Florida 33759 (US)
  • CHILUKURI, Pooja
    Morrisville, North Carolina 27560-6917 (US)
  • RINNE, Christine
    Apex, North Carolina 27502 (US)
  • RINNE, Glenn A.
    Apex, North Carolina 27502 (US)

(74) Representative: Vigars, Christopher Ian 
Haseltine Lake Redcliff Quay 120 Redcliff Street
GB-Bristol BS1 6HU
GB-Bristol BS1 6HU (GB)

   


(54) METHODS OF FORMING LEAD FREE SOLDER BUMPS AND RELATED STRUCTURES