(19)
(11) EP 1 772 246 A3

(12) EUROPEAN PATENT APPLICATION

(88) Date of publication A3:
17.10.2007 Bulletin 2007/42

(43) Date of publication A2:
11.04.2007 Bulletin 2007/15

(21) Application number: 06115177.5

(22) Date of filing: 08.06.2006
(51) International Patent Classification (IPC): 
B29C 35/00(2006.01)
B29C 45/73(2006.01)
(84) Designated Contracting States:
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
Designated Extension States:
AL BA HR MK YU

(30) Priority: 22.09.2005 JP 2005276249
11.04.2006 JP 2006109118

(71) Applicant: Star Seiki Co., Ltd.
Aichi 467-0827 (JP)

(72) Inventor:
  • NAGASAKA, Tatsuhiko STAR SEIKI CO LTD
    Niwa-gun Aichi (JP)

(74) Representative: TBK-Patent 
Bavariaring 4-6
80336 München
80336 München (DE)

   


(54) Mold temperature regulating apparatus


(57) A mold temperature regulating apparatus (1) includes a casing (5) which can be located indoors. Within the casing (5), there are installed a heating tank (12a,12b) through which a temperature-regulating medium returned from a mold passes, a cooling tank (15) for storing the common temperature-regulating medium (4) returned from the mold (M), a heater (13a,13b) for heating the temperature-regulating medium (4) in the heating tank (12a,12b),
a cooling system (16) for cooling the temperature-regulating medium (4) in the cooling tank, a confluence pump (17) that allows the temperature-regulating medium (4) cooled in the cooling tank (15) to join the temperature-regulating medium in the heating tank, and a medium-feeding pump (14a,14b) for feeding out the temperature-regulating medium (4) discharged from the heating tank (12a,12b) into the mold. The cooling system (16) is configured to indirectly cool the temperature-regulating medium (4) by a different cooling medium circulated in the casing (5).







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