| (19) |
 |
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(11) |
EP 1 788 034 A3 |
| (12) |
EUROPEAN PATENT APPLICATION |
| (88) |
Date of publication A3: |
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17.10.2007 Bulletin 2007/42 |
| (43) |
Date of publication A2: |
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23.05.2007 Bulletin 2007/21 |
| (22) |
Date of filing: 17.05.2001 |
|
| (51) |
International Patent Classification (IPC):
|
|
| (84) |
Designated Contracting States: |
|
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR |
| (30) |
Priority: |
17.05.2000 JP 2000145633
20.10.2000 JP 2000321241
|
| (62) |
Application number of the earlier application in accordance with Art. 76 EPC: |
|
01932118.1 / 1270675 |
| (71) |
Applicant: Dynic Corporation |
|
Kyoto-shi,
Kyoto 615-0812 (JP) |
|
| (72) |
Inventors: |
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- Kawaguchi, Yohei
Osaka-shi Osaka 541-0043 (JP)
- Fujimori, Masayuki
Inugami-gun Shiga 522-0341 (JP)
- Uchibori, Teruo
Inugami-gun Shiga 522-0341 (JP)
- Ohyama, Kaneto
Inugami-gun Shiga 522-0341 (JP)
- Nishino, Atsushi
Neyagawa-shi Osaka 572-0826 (JP)
|
| (74) |
Representative: Barz, Peter |
|
Patentanwalt
Kaiserplatz 2
80803 München
80803 München (DE) |
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| |
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| (54) |
Moisture absorbing formed article |
(57) An object of the present invention is to provide a material which can absorb moistuxe
with ease and certainly, which exists in an equipment such as an electronic device.
The invention relates to a moisture absorbing formed body comprising a hygroscopic
agent and a resinous component.