Coating liquid for forming silica-based film having low dielectric constant and substrate having film of low dielectric constant coated thereon

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EP 1 790 703 A8

(12)	CORRECTED EUROPEAN PATENT APPLICATION
	Note: Bibliography reflects the latest situation

(15)	Correction information:
	Corrected version no 1 (W1 A2)

(48)	Corrigendum issued on:
	30.06.2010 Bulletin 2010/26

(88)	Date of publication A3:
	12.08.2009 Bulletin 2009/33

(43)	Date of publication:
	30.05.2007 Bulletin 2007/22

(21)	Application number: 07002273.6

(22)	Date of filing: 15.04.1999

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International Patent Classification (IPC):

C09D 201/00^(2006.01)
G03F 7/00^(2006.01)

C08K 9/06^(2006.01)

(84)	Designated Contracting States:
	DE NL

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Priority:

24.04.1998 JP 11508298
21.05.1998 JP 13972398

(62)	Application number of the earlier application in accordance with Art. 76 EPC:
	99913676.5 / 0992556

(71)	Applicant: JGC Catalysts and Chemicals Ltd.
	Kawasaki-shi Kanagawa (JP)

(72)	Inventors:
	Nakashima, Akira c/o Kitakyushu Operation Center Kitakyushu-shi, Fukuoka 808-0027 (JP) Tonai, Atsushi c/o Kitakyushu Operation Center Kitakyushu-shi, Fukuoka 808-0027 (JP) Komatsu, Michio c/o Kitakyushu Operation Center Kitakyushu-shi, Fukuoka 808-0027 (JP)

(74)	Representative: Goddard, Christopher Robert
	Dehns St Bride's House 10 Salisbury Square London EC4Y 8JD London EC4Y 8JD (GB)


	Remarks:
	This application was filed on 02 - 02 - 2007 as a divisional application to the application mentioned under INID code 62.

(54)	Coating liquid for forming silica-based film having low dielectric constant and substrate having film of low dielectric constant coated thereon

(57) The coating liquid for forming a silica-containing film with a low dielectric constant according to the present invention comprises: (i) fine particles of silica having a phenyl group thereon, and (ii') an oxidatively decomposable resin, the weight ratio of the fine particles of silica having a phenyl group to the oxidatively decomposable resin being in the range of 0.5 to 5.
By virtue of the present invention, there can be formed a stable silica-containing film, which has a dielectric constant as low as 3 or less, which is excellent in microphotolithography workability, adherence to a substrate surface, chemical resistance such as alkali resistance and crack resistance, and which exhibits excellent planarizing performance.