(19)
(11) EP 1 794 224 A1

(12)

(43) Date of publication:
13.06.2007 Bulletin 2007/24

(21) Application number: 05803123.8

(22) Date of filing: 29.09.2005
(51) International Patent Classification (IPC): 
C08K 3/04(2006.01)
 H01L 23/373(2006.01)
(86) International application number:
PCT/US2005/034676
(87) International publication number:
WO 2006/039294 (13.04.2006 Gazette 2006/15)
(84) Designated Contracting States:
CH FR GB LI

(30) Priority: 30.09.2004 US 614949 P
29.09.2005 US 239713

(71) Applicant: Honeywell International Inc.
Morristown, NJ 07960 (US)

(72) Inventors:
  • HEFFNER, Kenneth
    Morristown, NJ 07962 (US)
  • DALZELL, William, J.
    Morristown, NJ 07962 (US)
  • FLEISCHMANN, Scott
    Morristown, NJ 07962 (US)

(74) Representative: Hucker, Charlotte Jane et al
Gill Jennings & Every Broadgate House 7 Eldon Street
London EC2M 7LH
London EC2M 7LH (GB)

   


(54) THERMALLY CONDUCTIVE COMPOSITE AND USES FOR MICROELECTRONIC PACKAGING