LGA connectors and package mount structures

(19)

(11)

EP 1 799 022 A3

(12)	EUROPEAN PATENT APPLICATION

(88)	Date of publication A3:
	04.11.2009 Bulletin 2009/45

(43)	Date of publication A2:
	20.06.2007 Bulletin 2007/25

(21)	Application number: 06251817.0

(22)	Date of filing: 31.03.2006

(51)

International Patent Classification (IPC):

H05K 7/10^(2006.01)

(84)	Designated Contracting States:
	AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
	Designated Extension States:
	AL BA HR MK YU

(30)

Priority:

14.12.2005 JP 2005360705

(71)	Applicant: Fujitsu Ltd.
	Kawasaki-shi, Kanagawa 211-8588 (JP)

(72)	Inventor:
	Sakairi, Makoto, c/o Fujitsu Limited Kawasaki-shi Kanagawa 211-8588 (JP)

(74)	Representative: Hitching, Peter Matthew et al
	Haseltine Lake LLP Lincoln House, 5th Floor 300 High Holborn London WC1V 7JH London WC1V 7JH (GB)

(54)	LGA connectors and package mount structures

(57) There is provided an LGA connector (1) for connecting an LGA package (4) mounted on a package board (5) with a printed board, the LGA connector includes columns (11) for conduction between the electrode of the LGA package and the electrode of the printed board (6) and a socket (12) supporting the columns, and the LGA connector includes a structure in which the columns receive an even load when the LGA package is mounted.

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