FIELD OF THE INVENTION
[0001] The present invention relates to a method for making a lithographic printing plate
support and to a method for making a heat- and/or light sensitive, lithographic printing
plate comprising said support.
BACKGROUND OF THE INVENTION
[0002] Lithographic printing presses use a so-called printing master such as a printing
plate which is mounted on a cylinder of the printing press. The master carries a lithographic
image on its surface and a print is obtained by applying ink to said image and then
transferring the ink from the master onto a receiver material, which is typically
paper. In conventional, so-called "wet" lithographic printing, ink as well as an aqueous
fountain solution (also called dampening liquid) are supplied to the lithographic
image which consists of oleophilic (or hydrophobic, i.e. ink-accepting, water-repelling)
areas as well as hydrophilic (or oleophobic, i.e. water-accepting, ink-repelling)
areas. In so-called driographic printing, the lithographic image consists of ink-accepting
and ink-abhesive (ink-repelling) areas and during driographic printing, only ink is
supplied to the master.
[0003] Printing masters are generally obtained by the image-wise exposure and processing
of an imaging material called plate precursor. In addition to the well-known photosensitive,
so-called pre-sensitized plates, which are suitable for UV contact exposure through
a film mask, also heat-sensitive printing plate precursors have become very popular
in the late 1990s. Such thermal materials offer the advantage of daylight stability
and are especially used in the so-called computer-to-plate method wherein the plate
precursor is directly exposed, i.e. without the use of a film mask. The material is
exposed to heat or to infrared light and the generated heat triggers a (physico-)chemical
process, such as ablation, polymerization, insolubilization by cross linking of a
polymer, heat-induced solubilization, or by particle coagulation of a thermoplastic
polymer latex.
[0004] Thermal processes which enable plate making without wet processing are for example
based on ablation of one or more layers of the coating. At the exposed areas the surface
of an underlying layer is revealed which has a different affinity towards ink or fountain
than the surface of the unexposed coating; the image (printing) and non-image or background
(non-printing) areas are obtained.
[0005] Another type of printing plates based on thermal processes requiring no wet processing
step are for example plates based on switching - i.e. plates of which the surface
is irreversibly changed from a hydrophilic surface to a hydrophobic surface or vice
versa upon exposure to heat and/or light. These so called "switchable polymer systems"
are based on different working mechanism such as for example masking/demasking of
a polar group or destruction/ generation of charge.
[0006] The most popular thermal plates form an image by a heat-induced solubility difference
in an alkaline developer between exposed and non-exposed areas of the coating. The
coating typically comprises an oleophilic binder, e.g. a phenolic resin, of which
the rate of dissolution in the developer is either reduced (negative working) or increased
(positive working) by the image-wise exposure. During processing, the solubility differential
leads to the removal of the non-image (non-printing) areas of the coating, thereby
revealing the hydrophilic support, while the image (printing) areas of the coating
remain on the support. Typical examples of such plates are described in e.g.
EP-A 625728,
823327,
825927,
864420,
894622 and
901902. Negative working embodiments of such thermal materials often require a pre-heat
step between exposure and development as described in e.g.
EP-A 625,728.
[0007] Negative working plate precursors which do not require a pre-heat step may contain
an image-recording layer that works by heat-induced particle coalescence of a thermoplastic
polymer latex, as described in e.g.
EP-As 770 494,
770 495,
770 496 and
770 497. These patents disclose a method for making a lithographic printing plate comprising
the steps of (1) image-wise exposing an imaging element comprising hydrophobic thermoplastic
polymer particles dispersed in a hydrophilic binder and a compound capable of converting
light into heat, (2) and developing the image-wise exposed element by applying fountain
and/or ink.
[0008] US 5,728,503 provides a grained and anodized aluminum support for a light sensitive printing plate
having a substantially uniform topography comprising peaks and valleys and surface
roughness parameters Ra (0.10-0.5 µm), Rt (0-6 µm), Rp (0-4 µm) and Rz (0-5 µm ).
[0009] EP 1,400,351 discloses a lithographic printing plate precursor containing an aluminum support
and a photosensitive layer containing an alkali-soluble resin and an infrared absorber,
wherein the photosensitive layer has a coating weight of 0.5 to 3 g/m
2 and a thickness distribution with a maximum relative standard deviation of 20%.
[0010] WO 02/01291 discloses a lithographic plate comprising on a roughened substrate a substantially
conformal radiation-sensitive layer; i.e. the surface of the radiation-sensitive layer
has peaks and valleys substantially corresponding to the major peaks and valleys of
the microscopic surface of the roughened substrate. Tackiness, block resistance and
press durability of the plate are improved.
[0011] Us 6,912,956 discloses a printing plate material comprising a substrate having a
center line average surface roughness Ra of 0.2 to 1.0 µm and an oil-retention volume
A2 of 1 to 10, and provided thereon a component layer onto which an image is capable
of being recorded by imagewise exposure with an infrared laser.
[0012] US 4,545,866 discloses electrochemically graining the surface of an aluminum support with an electrolytic
solution comprising 1000 to 40000 ppm of nitric acid and 50 to 4000 ppm of sulfuric
acid.
[0013] EP 036,672 discloses electrolytically etching of aluminum in an aqueous electrolytic solution
containing hydrochloric acid and citric acid or malic acid at a bath temperature of
10 to 40 °C.
[0014] US 4,671,859 and
US 4,376,124 disclose a process for the electrochemical graining of aluminum in which an electrolyte
composition containing β-ketones is employed.
US 4,482,434 discloses the roughening of aluminum by applying an electrolyte solution under the
action of an alternating current having a frequency in the range from 0.3 to 15 Hz.
[0015] In general, the use of aluminum substrates as supports for lithographic printing
plates, requires that they undergo several treatments such as for example graining
and anodizing. Lithographic supports are roughened or grained to improve the adhesion
of an imaging layer to the support and anodizing may be carried out to improve the
abrasion resistance and water retention of the support. The type of grains obtained,
especially their size and distribution over the surface, highly influence the lithographic
behaviour of the related printing plate. The pits on the aluminum surface have to
be deep enough to provide sufficient adhesion of the coating layer, they should be
evenly distributed over the surface and they should be uniform in size. The pits size
and distribution should provide a good balance between adhesion properties of the
coating at the image areas (i.e. print durability) and water retention and clean out
behavior at the non-image areas. When the microscopic structure of the roughened surface
is not uniform enough, especially adhesion problems have been reported. For positive-
or negative-working printing plates based on a solubility differential in a developer
solution, often clean-out problems during the development step (i.e. the non-image
areas are not completely and profoundly removed by the developer) have been reported.
Because of the roughened surface, part of the coating may fail to gain sufficient
solubility in a developer and may tend to remain on the support at non-image areas
resulting in toning (ink acceptance at the non-image areas). By applying a coating
layer which is easily removable in a developer, these clean out problems are then
for the most part resolved but a too narrow development lattitude is obtained. For
printing plates based on latex coalescence a reduced shelf life caused by a roughened
aluminum support has been reported in
EP 1,400,351. Other problems related to the microscopic structure of the aluminum plate are for
example a reduced image contrast after exposure and development (i.e. contrast between
image and non-image areas is small) which makes evaluation by the printer of the imaged
plate difficult, surfaces that are highly vulnerable to scratches and/or low quality
prints showing unsharp edges and toning.
[0016] Thus, graining of the support resulting in small pits uniformly distributed over
the surface, is essential for obtaining high quality printing plates. In the prior
art, the graining is usually carried out using hydrochloric acid as electrolyte. However,
in pure hydrochloric acid electrolytes, the operating conditions need to be within
close limits in order to obtain an even and uniform topography. Many patent publications
describe the influence of the electrolyte composition on the quality of graining.
Addition of several additives to hydrochloric acid as main component or to nitric
acid as main component have been proposed in the prior art. However, often the disclosed
methods are only applicable within closely limited parameters (such as for example
temperature and/or current density), and/or they require a great equipment expenditure,
and/or they do not provide the required type/distribution of grains. Therefore there
is still a need for graining processes which provide uniform and even grains on the
surface of a lithographic aluminum support as thereby a printing plate with both good
adhesion properties of the coating layer as well as a good water retention at the
non-image areas are obtained.
SUMMARY OF THE INVENTION
[0017] It is an object of the present invention to provide an alternative method for making
a lithographic aluminum printing plate support that has a surface comprising pits
which are uniformly distibuted over the surface and are uniform in size.
[0018] This object is realized by the method of claim 1; i.e. a method for making a lithographic
printing plate support which comprises the steps of:
- (i) providing an aluminum support;
- (ii) graining said support in an electrolyte composition comprising an effective concentration
of a benzoic acid derivative or a sulphonic acid derivative;
- (iii) anodizing said grained support.
[0019] It is a further object to provide a method for making a lithographic printing plate
that, after applying a heat- and/or light-sensitive coating, exposing and optional
developing said printing plate, does not show the occurence of coating residues, has
a good water retention at the non-image areas and has a high print durability.
[0020] This object is realized by the method of claim 6; i.e. a method for making a lithographic
printing plate which comprises the steps of: (i) providing a printing plate precursor
as described above; (ii) exposing the obtained printing plate precursor to heat and/or
light and (iii) optionally processing said exposed precursor with an aqueous liquid.
[0021] A detailed study of the microstructure of an aluminum support which was grained in
an electrolyte solution comprising an effective concentration of a benzoic acid derivative
or a sulphonic acid derivative, surprisingly showed that the surface of said support
comprises evenly distributed pits which are uniform in size. The detailed study of
the microstructure of the support was carried out using a newly developed threshold
procedure.
[0022] Preferred embodiments of the present invention are described in the dependent claims.
BRIEF DESCRIPTON OF THE DRAWINGS
[0023]
Fig. 1 shows a two-dimensional surface profile.
Fig. 2 shows a bearing ratio curve of a surface profile.
Fig. 3 shows the Rk-construction drawn on the bearing ratio curve.
Fig. 4 shows an interferometer image thresholded at height D defined in the Rk-construction, and wherein the gray-scale relates to the depth of the pits and their
distribution throughout the cross-section.
Fig. 5 shows a graph illustrating the newly developed threshold procedure for determination
of the pit size distribution.
DETAILED DESCRIPTION OF THE INVENTION
[0024] The lithographic printing plate support according to the method of the present invention
is an aluminum support. The surface of the aluminum support is grained and anodized
aluminum. The support may be a sheet-like material such as a plate or it may be a
cylindrical element such as a sleeve which can be slid around a print cylinder of
a printing press.
[0025] The aluminum is preferably anodized by means of anodizing techniques employing sulphuric
acid and/or a sulphuric acid/phosphoric acid mixture. By anodising the aluminium support,
its abrasion resistance and hydrophilic nature are improved. The microstructure as
well as the thickness of the Al
2O
3 layer are determined by the anodising step, the anodic weight (g/m
2 Al
2O
3 formed on the aluminium surface) varies between 1 and 8 g/m
2. Methods of anodizing are known in the art and are for example disclosed in
GB 2,088,901.
[0026] By graining (or roughening) the aluminium support, both the adhesion of the printing
image and the wetting characteristics of the non-image areas are improved. According
to the present invention, it was surprisingly found that graining the aluminum support
in an electrolyte solution comprising an effective concentration of a benzoic acid
derivative or a sulphonic acid derivative, results in a surface with uniformly distributed,
fine pits. The graining morphology of the surface was determined following a newly
developed threshold procedure which is disclosed further in the description.
[0027] The surface of the support is grained using an aqueous electrolyte solution comprising
an effective concentration of a benzoic acid derivative or a sulphonic acid derivative
and preferably at least one of the following chemicals: HNO
3, HCl and/or H
3PO
4. In a preferred embodiment the electrolyte solution contains HCl and an effective
concentration of a benzoic acid derivative or a sulphonic acid derivative.
[0028] The effective concentration of the benzoic acid derivative or the sulphonic acid
derivative is at least 0.0001 mol/1. Preferably the concentration varies between 0.0001
mol/l and 0.2 mol/l, more preferably between 0.0001 mol/l and 0.1 mol/l, most preferably
between 0.001 mol/l and 0.05 mol/l.
[0029] The concentration of HCl, HNO
3 and/or H
3PO
4 in the electrolyte solution preferably varies between 1 g/l and 50 g/l; more preferably
between 5 g/l and 30 g/l; most preferably between 7 g/l and 20 g/l.
[0030] A preferred benzoic acid derivative includes a benzoic acid such as ortho-, meta-
or para-substituted benzoic acid or di- or tri-substituted benzoic acid, a phtalic
acid, isophtalic acid, terephtalic acid, salicylic acid, benzoic anhydride, 1- naphtoic
acid or 2- naphtoic acid; or salts or esters thereof and each of which may be substituted.
Suitable salts are for example sodium, potassium or ammonium salts. A suitable ester
is for example an optionally substituted alkyl benzoic acid wherein the alkyl group
represents a straight, branched or cyclic alkyl group having up to 10 carbon atoms.
[0031] In a preferred embodiment, the benzoic acid derivative is an optionally substituted
benzoic acid.
[0032] The substituents optionally present on the benzoic acid derivatives are selected
from a halogen, a nitro group, a straight, branched or cyclic alkyl group having up
to 10 carbon atoms, a hydroxyl group, an amino group, a sulphonic acid group, a methoxygroup,
or combinations thereof.
[0033] A preferred sulphonic acid derivative includes a benzenesulphonic acid, benzenedisulphonic
acid, pyridine sulphonic acid, naphthalene sulphonic acid, naphthalene disulphonic
acid, alkyl sulphonic acid, alkylene sulphonic acid and quinoline sulphonic acid;
or salts or esters thereof; and each of which may be substituted. Suitable salts are
for example sodium, potassium or ammonium salts. A suitable ester is for example an
optionally substituted alkyl ester of a sulphonic acid such as an optionally substituted
alkyl benzenesulphonic acid or a pyridine alkyl sulphonic acid; wherein the alkyl
group represents a straight, branched or cyclic alkyl group having up to 10 carbon
atoms. The sulphonic acid derivatives may be mono- (ortho, meta or para), di- or tri-substituted.
The substituents optionally present on the sulphonic acid derivatives include a halogen,
an amino group, a nitro group, a hydroxyl group, a methoxygroup, a carboxylic acid
group, an optionally substituted straight, branched or cyclic alkyl group having up
to 10 carbon atoms, or combinations thereof.
[0034] In a preferred embodiment, the sulphonic acid derivative is an optionally substituted
benzenesulphonic acid.
[0035] The graining may be carried out using alternating current at a voltage ranging for
example from 5V to 50V, preferably from 20V to 40V for a period ranging from 5 to
120 seconds. Generally, the current density ranges from 50 A/dm
2 to 200 A/dm
2, more preferably from 80 A/dm
2 to 150 A/dm
2. The current charge preferably ranges from 300 C/dm
2 to 1500 C/dm
2, more preferably from 500 C/dm
2 to 1050 C/dm
2. The electrolyte temperature may be at any suitable temperature but preferably ranges
from 20°C to 55°C, more preferably from 30°C to 45°C.
[0036] The grained and anodized aluminum substrate of the present invention may be post-treated
to further improve the hydrophilic properties of its surface. For example, the aluminum
oxide surface may be silicated by treatment with a sodium silicate solution at elevated
temperature, e.g. 95°C. Alternatively, a phosphate treatment may be applied which
involves treating the aluminum oxide surface with a phosphate solution that may further
contain an inorganic fluoride. Further, the aluminum oxide surface may be rinsed with
an organic acid and/or salt thereof, e.g. carboxylic acids, hydrocarboxylic acids,
sulphonic acids or phosphonic acids, or their salts, e.g. succinates, phosphates,
phosphonates, sulphates, and sulphonates. A citric acid or citrate solution is preferred.
This treatment may be carried out at room temperature or may be carried out at a slightly
elevated temperature of about 30°C to 50°C. A further interesting treatment involves
rinsing the aluminum oxide surface with a bicarbonate solution. Still further, the
aluminum oxide surface may be treated with polyvinylphosphonic acid, polyvinylmethylphosphonic
acid, phosphoric acid esters of polyvinyl alcohol, polyvinylsulphonic acid, polyvinylbenzenesulphonic
acid, sulfuric acid esters of polyvinyl alcohol, and acetals of polyvinyl alcohols
formed by reaction with a sulfonated aliphatic aldehyde. It is further evident that
one or more of these post treatments may be carried out alone or in combination. More
detailed descriptions of these treatments are given in
GB 1084070,
DE 4423140,
DE 4417907,
EP 659909,
EP 537633,
DE 4001466,
EP A 292801,
EP A 291760 and
US 4458005.
[0037] The graining morphology of the surface was determined according to the following
newly developed threshold procedure.
[0038] First, three dimensional images are recorded of the substrate which characterize
the graining morphology surface or the roughness properties of the surface of said
substrate. From these images several parameters that describe various aspects of the
surface-morphology can be calculated. Tthe Bearing Ratio Analysis technique (see for
example
Wyko Surface Profilers Technical Reference Manual, September 1999, from Veeko, Metrology
Group (pages 3-3 to 3-11) or
US 2004/0103805), has been used for calculating these parameters. The three dimensional images or
surface profiles can be obtained by using a white-light interferometer from Veeco
(NT3300, commercially available from Veeco Metology Group, Arizona, USA).
[0039] From the obtained surface profile, two curves can be derived: the histogram of the
surface profile (Figure 1) and the bearing ratio curve (Figure 2). The histogram of
the surface profile, also called Amplitude Distribution Function (ADF), gives the
probability that the profile of the surface has a certain height z at any xy position.
In other words, the ADF gives the probability that a point on the surface profile
at a randomly selected position xy, has a height of approximately z. The bearing ratio
curve is the mathematical integral of the ADF and each point on the bearing ratio
curve has the physical significance of showing what fraction of a profile lies above
a certain height. In other words, the bearing ratio curve shows the percentage of
intercepted material by a plane parallel to the surface plane, versus the depth of
that plane into the surface.
[0040] From the bearing ratio curve, parameters describing the surface morphology are defined
using the so-called Rk-construction (Figure 3). These parameters are core roughness
depth (Rk), reduced peak height (Rpk), reduced valley depth (Rvk) and valley material
component (100%-Mr2) and are defined as follows in the ISO standard 13565-1996:
Core roughness depth (Rk): is the vertical height between the left and right intercepts of the line through
the ends of the minimum height 40% window.
Reduced peak height (Rpk): is an estimate of the small peaks above the main plateau of the surface.
Reduced valley depth (Rvk): is an estimate of the depth of the valleys.
Peak material component (Mr1): is the fraction of the surface that consists of small peaks.
Valley material component (100%-Mr2): is the fraction of the surface that consists of deeper valleys.
[0041] The heights C and D at the surface profile are determined in the R
k-construction by identyfying the minimum secant slope. The minimum secant slope is
obtained by sliding a 40% window (of the 0 to 100% axis in Figure 3) across the bearing
ratio curve (6). This window intersects the curve at two points, i.e. points A and
B and the goal is to find the position where the slope between the two points is minimised.
When the minimum slope is found, a line (7) through points A and B is drawn and the
intercepts on the ordinates at bearing ratio 0% and 100% yield respectively points
C and D.
[0042] According to the present invention, a new threshold procedure based on the parameters
defined in the R
k construction has been defined which enables to evaluate the pit size distribution.
[0043] For the evaluation of the pit size distribution, first of all the three dimensional
interferometer image is thresholded at height D (Figure 4). Figure 4 is in fact a
cross-section at height D of the aluminium surface and shows the pits at this height.
The gray-scale of Figure 4 relates to the depth of the pits and their distribution
throughout the cross-section. Each pixel has a depth value that enables to create
the grey-scale image. The threshold enables to identify and separate objects, i.e.
pits. The pits are separated from each other using a convex-components analysis. The
area, depth, and volume of each single pit can then be calculated using appropiate
software such as Matlab. For example, the area of a pit is calculated on the tresholded
image by multiplying the number of pixels belonging to a pit with the physical area
of one pixel. From these values the mean and standard deviation of the pit area, depth
and volume at the threshold height can be calculated. The pit depth obtained from
this threshold procedure is corrected to the real depth by adding R
k (Figure 5). Similarly, the volume of the pit is also corrected by adding the volume
of a cylinder having as area the calculated area of the pit (at level D) and as height
Rk (Figure 5). The pits with a depth lower than R
k + R
pk (indicated by the arrow in Figure 5) are not identified as pits by this image analysis.
However, this threshold procedure enables to compare the size distribution of the
deep pits of different substrates.
[0044] It was found that the results of pit area and volume obtained via the above described
procedure and measured on a support obtained according to the method of the present
invention, are smaller and uniformly distributed over the substrate compared to the
results of pit area and volume obtained on a support of the prior art.
[0045] According to the present invention, there is also provided a method for making a
lithographic printing plate precursor comprising the steps of providing a support
as discussed in detail above, applying a coating solution comprising at least one
heat- or light-sensitive imaging layer onto said support and than drying the obtained
precursor.
[0046] The precursor can be negative or positive working, i.e. can form ink-accepting areas
at exposed or at non-exposed areas respectively. Below, suitable examples of heat-
and light-sensitive coatings are discussed in detail.
Heat-sensitive printing plate precursors.
[0047] The imaging mechanism of thermal printing plate precursors can be triggered by direct
exposure to heat, e.g. by means of a thermal head, or by the light absorption of one
or more compounds in the coating that are capable of converting light, more preferably
infrared light, into heat.
[0049] In a second suitable embodiment, the thermal printing plate precursor comprises a
coating comprising an aryldiazosulfonate homo- or copolymer which is hydrophilic and
soluble in the processing liquid before exposure to heat or UV light and rendered
hydrophobic and less soluble after such exposure.
[0050] Preferred examples of such aryldiazosulfonate polymers are the compounds which can
be prepared by homo- or copolymerization of aryldiazosulfonate monomers with other
aryldiazosulfonate monomers and/or with vinyl monomers such as (meth)acrylic acid
or esters thereof, (meth)acrylamide, acrylonitrile, vinylacetate, vinylchloride, vinylidene
chloride, styrene, α-methyl styrene etc. Suitable aryldiazosulfonate monomers are
disclosed in
EP-A 339393,
EP-A 507008 and
EP-A 771645 and suitable aryldiazosulfonate polymers are disclosed in
EP 507,008,
EP 960,729,
EP 960,730 and
EP1,267,211.
[0051] A further suitable thermal printing plate is positive working and relies on heat-induced
solubilization of an oleophilic resin. The oleophilic resin is preferably a polymer
that is soluble in an aqueous developer, more preferably an aqueous alkaline developing
solution with a pH between 7.5 and 14. Preferred polymers are phenolic resins e.g.
novolac, resoles, polyvinyl phenols and carboxy substituted polymers. Typical examples
of these polymers are described in
DE-A-4007428,
DE-A-4027301 and
DE-A-4445820. The amount of phenolic resin present in the first layer is preferably at least 50%
by weight, preferably at least 80% by weight relative to the total weight of all the
components present in the first layer.
[0052] In a preferred embodiment, the oleophilic resin is preferably a phenolic resin wherein
the phenyl group or the hydroxy group is chemically modified with an organic substituent.
The phenolic resins which are chemically modified with an organic substituent may
exhibit an increased chemical resistance against printing chemicals such as fountain
solutions or press chemicals such as plate cleaners. Examples of such chemically modified
phenolic resins are described in
EP-A 0 934 822,
EP-A 1 072 432,
US 5 641 608,
EP-A 0 982 123,
WO 99/01795,
EP-A 02 102 446,
EP-A 02 102 444,
EP-A 02 102 445,
EP-A 02 102 443,
EP-A 03 102 522. The modified resins described in
EP-A 02 102 446, are preferred, especially those resins wherein the phenyl-group of said phenolic
resin is substituted with a group having the structure -N=N-Q, wherein the -N=N- group
is covalently bound to a carbon atom of the phenyl group and wherein Q is an aromatic
group.
[0053] In the latter embodiment the coating may comprise a second layer that comprises a
polymer or copolymer (i.e. (co)polymer) comprising at least one monomeric unit that
comprises at least one sulfonamide group. This layer is located between the layer
described above comprising the oleophilic resin and the hydrophilic support. Hereinafter,
'a (co)polymer comprising at least one monomeric unit that comprises at least one
sulfonamide group' is also referred to as "a sulphonamide (co)polymer". The sulphonamide
(co)polymer is preferably alkali soluble. The sulphonamide group is preferably represented
by -NR-SO
2-, -SO
2-NR- or -SO
2-NRR' wherein R and R' each independently represent hydrogen or an organic substituent.
[0054] Sulfonamide (co)polymers are preferably high molecular weight compounds prepared
by homopolymerization of monomeric units containing at least one sulfonamide group
or by copolymerization of such monomeric units and other polymerizable monomeric units.
[0055] Examples of monomeric units containing at least one sulfonamide group include monomeric
units further containing at least one polymerizable unsaturated bond such as an acryloyl,
allyl or vinyloxy group. Suitable examples are disclosed in
U.S. 5,141,838,
EP 1545878,
EP 909,657,
EP 0 894 622 and
EP 1,120,246.
[0056] Examples of monomeric units copolymerized with the monomeric units containing at
least one sulfonamide group include monomeric units as disclosed in
EP 1,262,318,
EP 1,275,498,
EP 909,657,
EP 1,120,246,
EP 0 894 622 and
EP 1,400,351.
[0058] A highly preferred example of a sulfonamide (co)polymer is a homopolymer or copolymer
comprising a structural unit represented by the following general formula (I):

wherein:
R1 represents hydrogen or a hydrocarbon group having up to 12 carbon atoms; preferably
R1 represents hydrogen or a methyl group;
R2 and R3 independently represent hydrogen or a hydrocarbon group; preferably R2 and R represent hydrogen;
X1 represents a single bond or a divalent linking group. The divalent linking group
may have up to 20 carbon atoms and may contain at least one atom selected from C,
H, N, O and S.
Preferred divalent linking groups are a linear alkylene group having 1 to 18 carbon
atoms, a linear, branched, or cyclic group having 3 to 18 carbon atoms, an alkynylene
group having 2 to 18 carbon atoms and an arylene group having 6 to 20 atoms, -O-,
-S-, -CO-, -CO-O-,-O-CO-, -CS-, -NRhRi -, -CO-NRh-, -NRh-CO-, -NRh-CO-O-, -O-CO-NRh-,-NRh-CO-NRi-, -NRh-CS-NRi -, a phenylene group, a naphtalene group, an anthracene group, a heterocyclic group,
or combinations thereof, wherein Rh and Ri each independently represent hydrogen or an optionally substituted alkyl, alkenyl,
alkynyl, cycloalkyl, heterocyclic, aryl, heteroaryl, aralkyl or heteroaralkyl group.
Preferred substituents on the latter groups are an alkoxy group having up to 12 carbon
atoms, a halogen or a hydroxyl group. Preferably X1 is a methylene group, an ethylene group, a propylene group, a butylene group, an
isopropylene group, cyclohexylene group, a phenylene group, a tolylene group or a
biphenylene group;
Y1 is a bivalent sulphonamide group represented by -NRj-SO2- or -SO2-NRk- wherein Rj and Rk each independently represent hydrogen, an optionally substituted alkyl, alkanoyl,
alkenyl, alkynyl, cycloalkyl, heterocyclic, aryl, heteroaryl, aralkyl or heteroaralkyl
group or a group of the formula -C(=N)-NH-R2, wherein R2 represents hydrogen or an optionally substituted alkyl or aryl group;
Z1 represents a bi-, tri- or quadrivalent linking group or a terminal group. When Z1 is a bi-, tri- or quadrivalent linking group, the remaining 1 to 3 bonds of Z1 are linked to Y1 forming crosslinked structural units.
When Z1 is a terminal group, it is preferably represented by hydrogen or an optionally substituted
linear, branched, or cyclic alkylene or alkyl group having 1 to 18 carbon atoms such
as a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group,
an isobutyl group, a t-butyl group, a s-butyl group, a pentyl group, a hexyl group,
a cyclopentyl group, a cyclohexyl group, an octyl group, an optionally substituted
arylene or aryl group having 6 to 20 carbon atoms; an optionally substituted hetero-arylene
or heteroaryl group; a linear, branched, or cyclic alkenylene or alkenyl group having
2 to 18 carbon atoms, a linear, branched, or cyclic alkynylene or alkynyl group having
2 to 18 carbon atom or an alkoxy group.
When Z is a bi, tri- or quadrivalent linking group, it is preferably represented by
an above mentioned terminal group of which hydrogen atoms in numbers corresponding
to the valence are eliminated therefrom.
Examples of preferred substituents optionally present on the groups representing Z
1 are an alkyl group having up to 12 carbon atoms, an alkoxy group having up to 12
carbon atoms, a halogen atom or a hydroxyl group.
[0059] The structural unit represented by the general formula (I) has preferably the following
groups:
X1 represents an alkylene, cyclohexylene, phenylene or tolylene group, -O-, -S-, -CO-,
-CO-O-, -O-CO-, -CS-, -NRhRi-, -CO-NRh-, -NRh-CO-, -NRh-CO-O-, -O-CO-NRh-, -NRh-CO-NRi-, -NRh-CS-NRi-, or combinations thereof, and wherein Rh and Ri each independently represent hydrogen or an optionally substituted alkyl, alkenyl,
alkynyl, cycloalkyl, heterocyclic, aryl, heteroaryl, aralkyl or heteroaralkyl group.
Preferred substituents on the latter groups are an alkoxy group having up to 12 carbon
atoms, a halogen or a hydroxyl group;
Y1 is a bivalent sulphonamide group represented by -NRj-SO2-, -SO2-NRk- wherein Rj and Rk each independently represent hydrogen, an optionally substituted alkyl, alkanoyl,
alkenyl, alkynyl, cycloalkyl, heterocyclic, aryl, heteroaryl, aralkyl or heteroaralkyl
group;
Z1 is a terminal group represented by hydrogen, an alkyl group such as a methyl group,
an ethyl group, a propyl group, an isopropyl group, a butyl group, an isobutyl group,
a t-butyl group, a s-butyl group, a pentyl group, a hexyl group, a cyclopentyl group,
a cyclohexyl group or an octyl group, a benzyl group, an optionally substituted aryl
or heteroaryl group, a naphtyl group, an anthracenyl group, a pyridyl group, an allyl
group or a vinyl group.
[0060] Specific preferred examples of sulphonamide (co)polymers are polymers comprising
N-(p-aminosulfonylphenyl) (meth)acrylamide, N-(m-aminosulfonylphenyl) (meth)acrylamide
and/or N-(o-aminosulfonylphenyl) (meth)acrylamide. A particularly preferred sulphonamide
(co)polymer is a polymer comprising N-(p-aminosulphonylphenyl) methacrylamide wherein
the sulphonamide group comprises an optionally substituted straight, branched, cyclic
or heterocyclic alkyl group, an optionally substituted aryl group or an optionally
substituted heteroaryl group.
[0061] The layer comprising the sulphonamide (co)polymer may further comprise additional
hydrophobic binders such as a phenolic resin (e.g. novolac, resoles or polyvinyl phenols),
a chemically modified phenolic resin or a polymer containing a carboxyl group, a nitrile
group or a maleimide group.
[0062] The dissolution behavior of the coating of the latter embodiment in the developer
can be fine-tuned by optional solubility regulating components. More particularly,
development accelerators and development inhibitors can be used. In the embodiment
where the coating comprises more than one layer, these ingredients can be added to
the first layer, to the second layer and/or to an optional other layer of the coating.
[0063] Development accelerators are compounds which act as dissolution promoters because
they are capable of increasing the dissolution rate of the coating. For example, cyclic
acid anhydrides, phenols or organic acids can be used in order to improve the aqueous
developability. Examples of the cyclic acid anhydride include phthalic anhydride,
tetrahydrophthalic anhydride, hexahydrophthalic anhydride, 3,6-endoxy-4-tetrahydro-phthalic
anhydride, tetrachlorophthalic anhydride, maleic anhydride, chloromaleic anhydride,
alpha -phenylmaleic anhydride, succinic anhydride, and pyromellitic anhydride, as
described in
U.S. Patent No. 4,115,128. Examples of the phenols include bisphenol A, p-nitrophenol, p-ethoxyphenol, 2,4,4'-trihydroxybenzophenone,
2,3,4-trihydroxybenzophenone, 4-hydroxybenzophenone, 4,4',4"-trihydroxytriphenylmethane,
and 4,4',3",4"-tetrahydroxy-3,5,3',5'-tetramethyltriphenyl-methane, and the like.
Examples of the organic acids include sulphonic acids, sulfinic acids, alkylsulfuric
acids, phosphonic acids, phosphates, and carboxylic acids, as described in, for example,
JP-A Nos. 60-88,942 and
2-96,755. Specific examples of these organic acids include p-toluenesulphonic acid, dodecylbenzenesulphonic
acid, p-toluenesulfinic acid, ethylsulfuric acid, phenylphosphonic acid, phenylphosphinic
acid, phenyl phosphate, diphenyl phosphate, benzoic acid, isophthalic acid, adipic
acid, p-toluic acid, 3,4-dimethoxybenzoic acid, 3,4,5-trimethoxybenzoic acid, 3,4,5-trimethoxycinnamic
acid, phthalic acid, terephthalic acid, 4-cyclohexene-1,2-dicarboxylic acid, erucic
acid, lauric acid, n-undecanoic acid, and ascorbic acid. The amount of the cyclic
acid anhydride, phenol, or organic acid contained in the coating is preferably in
the range of 0.05 to 20% by weight, relative to the coating as a whole. Polymeric
development accelerators such as phenolic-formaldehyde resins comprising at least
70 mol% meta-cresol as recurring monomeric units are also suitable development accelerators.
[0064] In a preferred embodiment, the coating also contains developer resistance means,
also called development inhibitors, i.e. one or more ingredients which are capable
of delaying the dissolution of the unexposed areas during processing. The dissolution
inhibiting effect is preferably reversed by heating, so that the dissolution of the
exposed areas is not substantially delayed and a large dissolution differential between
exposed and unexposed areas can thereby be obtained. The compounds described in e.g.
EP-A 823 327 and
WO97/39894 are believed to act as dissolution inhibitors due to interaction, e.g. by hydrogen
bridge formation, with the alkali-soluble resin(s) in the coating. Inhibitors of this
type typically comprise at least one hydrogen bridge forming group such as nitrogen
atoms, onium groups, carbonyl (-CO-), sulfinyl (-SO-) or sulfonyl (-SO
2-) groups and a large hydrophobic moiety such as one or more aromatic rings. Some
of the compounds mentioned below, e.g. infrared dyes such as cyanines and contrast
dyes such as quaternized triarylmethane dyes can also act as a dissolution inhibitor.
[0065] Other suitable inhibitors improve the developer resistance because they delay the
penetration of the aqueous alkaline developer into the coating. Such compounds can
be present in the first layer and/or, if present, in the second layer as described
in e.g.
EP-A 950 518, and/or in a development barrier layer on top of said layer, as described in e.g.
EP-A 864 420,
EP-A 950 517,
WO 99/21725 and
WO 01/45958. In the latter embodiment, the solubility of the barrier layer in the developer or
the penetrability of the barrier layer by the developer can be increased by exposure
to heat or infrared light.
[0066] Preferred examples of inhibitors which delay the penetration of the aqueous alkaline
developer into the coating include the following:
- (a) A polymeric material which is insoluble in or impenetrable by the developer, e.g.
a hydrophobic or water-repellent polymer or copolymer such as acrylic polymers, polystyrene,
styrene-acrylic copolymers, polyesters, polyamides, polyureas, polyurethanes, nitrocellulosics
and epoxy resins; or polymers comprising siloxane (silicones) and/or perfluoroalkyl
units.
- (b) Bifunctional compounds such as surfactants comprising a polar group and a hydrophobic
group such as a long chain hydrocarbon group, a poly- or oligosiloxane and/or a perfluorinated
hydrocarbon group. A typical example is Megafac F-177, a perfluorinated surfactant
available from Dainippon Ink & Chemicals, Inc. A suitable amount of such compounds
is between 10 and 100 mg/m2 more preferably between 50 and 90 mg/m2.
- (c) Bifunctional block-copolymers comprising a polar block such as a poly- or oligo(alkylene
oxide) and a hydrophobic block such as a long chain hydrocarbon group, a poly- or
oligosiloxane and/or a perfluorinated hydrocarbon group. A suitable amount of such
compounds is between 0.5 and 25 mg/m2, preferably between 0.5 and 15 mg/m2 and most preferably between 0.5 and 10 mg/m2. A suitable copolymer comprises about 15 to 25 siloxane units and 50 to 70 alkyleneoxide
groups. Preferred examples include copolymers comprising phenylmethylsiloxane and/or
dimethylsiloxane as well as ethylene oxide and/or propylene oxide, such as Tego Glide
410, Tego Wet 265, Tego Protect 5001 or Silikophen P50/X, all commercially available
from Tego Chemie, Essen, Germany. Said poly- or oligosiloxane may be a linear, cyclic
or complex cross-linked polymer or copolymer. The term polysiloxane compound shall
include any compound which contains more than one siloxane group -Si(R,R')-O-, wherein
R and R' are optionally substituted alkyl or aryl groups. Preferred siloxanes are
phenylalkylsiloxanes and dialkylsiloxanes. The number of siloxane groups in the polymer
or oligomer is at least 2, preferably at least 10, more preferably at least 20. It
may be less than 100, preferably less than 60.
[0067] It is believed that during coating and drying, the above mentioned inhibitor of type
(b) and (c) tends to position itself, due to its bifunctional structure, at the interface
between the coating and air and thereby forms a separate top layer even when applied
as an ingredient of the coating solution of the first and/or of the optional second
layer. Simultaneously, the surfactants also act as a spreading agent which improves
the coating quality. The separate top layer thus formed seems to be capable of acting
as the above mentioned barrier layer which delays the penetration of the developer
into the coating.
[0068] Alternatively, the inhibitor of type (a) to (c) can be applied in a separate solution,
coated on top of the first, optional second and/or other layers of the coating. In
that embodiment, it may be advantageous to use a solvent in the separate solution
that is not capable of dissolving the ingredients present in the other layers so that
a highly concentrated water-repellent or hydrophobic phase is obtained at the top
of the coating which is capable of acting as the above mentioned development barrier
layer.
[0069] In addition, the first or optional second layer and/or other layer may comprise polymers
that further improve the run length and/or the chemical resistance of the plate. Examples
thereof are polymers comprising imido (-CO-NR-CO-) pendant groups, wherein R is hydrogen,
optionally substituted alkyl or optionally substituted aryl, such as the polymers
described in
EP-A 894 622,
EP-A 901 902,
EP-A 933 682 and
WO 99/63407.
[0070] The coating of the heat-sensitive printing plate precursors described above preferably
also contains an infrared light absorbing dye or pigment which, in the embodiment
where the coating comprises more than one layer, may be present in the first layer,
and/or in the second layer, and/or in an optional other layer. Preferred IR absorbing
dyes are cyanine dyes, merocyanine dyes, indoaniline dyes, oxonol dyes, pyrilium dyes
and squarilium dyes. Examples of suitable IR dyes are described in e.g.
EP-As 823327,
978376,
1029667,
1053868,
1093934;
WO 97/39894 and
00/29214. Preferred compounds are the following cyanine dyes:

[0071] The concentration of the IR-dye in the coating is preferably between 0.25 and 15.0
%wt, more preferably between 0.5 and 10.0 %wt, most preferably between 1.0 and 7.5
%wt relative to the coating as a whole.
[0072] The coating may further comprise one or more colorant(s) such as dyes or pigments
which provide a visible color to the coating and which remain in the coating at unexposed
areas so that a visible image is obtained after exposure and processing. Such dyes
are often called contrast dyes or indicator dyes. Preferably, the dye has a blue color
and an absorption maximum in the wavelength range between 600nm and 750 nm. Although
the dye absorbs visible light, it preferably does not sensitize the printing plate
precursor, i.e. the coating does not become more soluble in the developer upon exposure
to visible light. Typical examples of such contrast dyes are the amino-substituted
tri- or diarylmethane dyes, e.g. crystal violet, methyl violet, victoria pure blue,
flexoblau 630, basonylblau 640, auramine and malachite green. Also the dyes which
are discussed in depth in
EP-A 400,706 are suitable contrast dyes. The contrast dye(s) may be present in the first layer,
and/or in the optional second and/or other layers.
[0073] The heat-sensitive plate precursor can be image-wise exposed directly with heat,
e.g. by means of a thermal head, or indirectly by infrared light, preferably near
infrared light. The infrared light is preferably converted into heat by an IR light
absorbing compound as discussed above. The heat-sensitive lithographic printing plate
precursor is preferably not sensitive to visible light, i.e. no substantial effect
on the dissolution rate of the coating in the developer is induced by exposure to
visible light. Most preferably, the coating is not sensitive to ambient daylight.
[0074] The printing plate precursor can be exposed to infrared light by means of e.g. LEDs
or a laser. Most preferably, the light used for the exposure is a laser emitting near
infrared light having a wavelength in the range from about 750 to about 1500 nm, more
preferably 750 to 1100 nm, such as a semiconductor laser diode, a Nd:YAG or a Nd:YLF
laser. The required laser power depends on the sensitivity of the plate precursor,
the pixel dwell time of the laser beam, which is determined by the spot diameter (typical
value of modern plate-setters at 1/e
2 of maximum intensity : 5-25 µm), the scan speed and the resolution of the exposure
apparatus (i.e. the number of addressable pixels per unit of linear distance, often
expressed in dots per inch or dpi; typical value : 1000-4000 dpi).
[0075] Two types of laser-exposure apparatuses are commonly used: internal (ITD) and external
drum (XTD) platesetters. ITD plate-setters for thermal plates are typically characterized
by a very high scan speed up to 500 m/sec and may require a laser power of several
Watts. XTD plate-setters for thermal plates having a typical laser power from about
200 mW to about 1 W operate at a lower scan speed, e.g. from 0.1 to 10 m/sec. An XTD
platesetter equipped with one or more laserdiodes emitting in the wavelength range
between 750 and 850 nm is an especially preferred embodiment for the method of the
present invention.
[0076] The known plate-setters can be used as an off-press exposure apparatus, which offers
the benefit of reduced press down-time. XTD plate-setter configurations can also be
used for on-press exposure, offering the benefit of immediate registration in a multi-color
press. More technical details of on-press exposure apparatuses are described in e.g.
US 5,174,205 and
US 5,163,368.
[0077] After exposure, the precursor can be developed by means of a suitable processing
liquid, such as an aqueous alkaline solution, whereby the non-image areas of the coating
are removed; the development step may be combined with mechanical rubbing, e.g. by
using a rotating brush. During development, any water-soluble protective layer present
is also removed. The heat-sensitive printing plate precursors based on latex coalescence,
can also be developed using plain water or aqueous solutions, e.g. a gumming solution.
The gum solution is typically an aqueous liquid which comprises one or more surface
protective compounds that are capable of protecting the lithographic image of a printing
plate against contamination or damaging. Suitable examples of such compounds are film-forming
hydrophilic polymers or surfactants. The gum solution has preferably a pH from 4 to
10, more preferably from 5 to 8. Preferred gum solutions are described in
EP 1,342,568. Alternatively, such printing plate precursors can after exposure directly be mounted
on a printing press and be developed on-press by supplying ink and/or fountain to
the precursor.
Light-sensitive printing plate precursors.
[0079] In addition to the above thermal materials, also light-sensitive coatings can be
used in the methods of the present invention. Typical examples of such plates are
the UV-sensitive "PS" plates and the so-called photopolymer plates which contain a
photopolymerizable composition that hardens upon exposure to light.
[0080] In a particular embodiment of the present invention, a conventional, UV-sensitive
"PS" plate is used. Suitable examples of such plates, that are sensitive in the range
of 300-450 nm (near UV and blue light), have been discussed in
EP 1,029,668 A2. Positive and negative working compositions are typically used in "PS" plates.
[0081] The positive working imaging layer preferably comprises an o-naphtoquinonediazide
compound (NQD) and an alkali soluble resin. Particularly preferred are o-naphthoquinone-diazidosulphonic
acid esters or o-naphthoquinone diazidocarboxylic acid esters of various hydroxyl
compounds and o-naphthoquinone-diazidosulphonic acid amides or o-naphthoquinone-diazidocarboxylic
acid amides of various aromatic amine compounds. Two variants of NQD systems can be
used: one-component systems and two-component systems. Such light-sensitive printing
plates have been widely disclosed in the prior art, for example in
U.S. 3,635,709,
J.P. KOKAI No. 55-76346,
J.P. KOKAI No. Sho 50-117503,
J.P. KOKAI No. Sho 50-113305,
U.S. 3,859,099;
U.S. 3,759,711;
GB-A 739654,
US 4,266,001 and
J.P. KOKAI No. 55-57841.
[0082] The negative working layer of a "PS" plate preferably comprises a diazonium salt,
a diazonium resin or an aryldiazosulfonate homo- or copolymer. Suitable examples of
low-molecular weight diazonium salts include: benzidine tetrazoniumchloride, 3,3'-dimethylbenzidine
tetrazoniumchloride, 3,3'-dimethoxybenzidine tetrazoniumchloride, 4,4'-diaminodiphenylamine
tetrazoniumchloride, 3,3'-diethylbenzidine tetrazoniumsulfate, 4-aminodiphenylamine
diazoniumsulfate, 4-aminodiphenylamine diazoniumchloride, 4-piperidino aniline diazoniumsulfate,
4-diethylamino aniline diazoniumsulfate and oligomeric condensation products of diazodiphenylamine
and formaldehyde. Examples of diazo resins include condensation products of an aromatic
diazonium salt as the light-sensitive substance. Such condensation products are described,
for example, in
DE-P-1 214 086. The light- or heat-sensitive layer preferably also contains a binder e.g. polyvinyl
alcohol.
[0083] Upon exposure the diazo resins or diazonium salts are converted from water soluble
to water insoluble (due to the destruction of the diazonium groups) and additionally
the photolysis products of the diazo may increase the level of crosslinking of the
polymeric binder or diazo resin, thereby selectively converting the coating, in an
image pattern, from water soluble to water insoluble. The unexposed areas remain unchanged,
i.e. water-soluble.
[0084] Such printing plate precursors can be developed using an aqueous alkaline solution
as described above.
[0085] In a second suitable embodiment, the light sensitive printing plate is based on a
photo-polymerisation reaction and contains a coating comprising a photocurable composition
comprising a free radical initiator (as disclosed in for example
US 5,955,238;
US 6,037,098;
US 5,629,354;
US 6,232,038;
US 6,218,076;
US 5,955,238;
US 6,037,098;
US 6, 010, 824;
US 5,629,354;
DE 1,470,154;
EP 024,629;
EP 107,792;
US 4,410,621;
EP 215,453;
DE 3,211,312 and
EP A 1,091,247) a polymerizable compound (as disclosed in
EP1,161,4541,
EP 1349006,
W02005/109103 and unpublished
European patent applications EP 5,111,012.0,
EP 5,111,025.2,
EP 5110918.9 and
EP 5, 110,961.9) and a polymeric binder (as disclosed in for example
US2004/0260050,
US2005/0003285;
US2005/0123853;
EP 1,369,232;
EP 1,369,231;
EP 1,341,040;
US 2003/0124460,
EP 1 241 002,
EP 1 288 720,
US 6,027,857,
US 6,171,735;
US 6,420,089;
EP 152,819;
EP 1,043, 627;
US 6,899,994;
US2004/0260050;
US 2005/0003285;
US2005/0170286;
US2005/0123853;
US2004/0260050;
US2005/0003285;
US 2004/0260050;
US 2005/0003285;
US 2005/0123853 and
US2005/0123853). Other ingredients such as sensitizers, co-initiators, adhesion promoting compounds,
colorants, surfactants and/or printing out agents may optionally be added. These printing
plates can be sensitized with blue, green or red light (i.e. wavelength range between
450 and 750 nm), with violet light (i.e. wavelength range between 350 and 450 nm)
or with infrared light (i.e. wavelength range between 750 and 1500 nm) using for example
an Ar laser (488 nm) or a FD-YAG laser (532 nm), semiconductor lasers InGaN (350 to
450 nm), an infrared laser diode (830 nm) or a Nd-YAG laser (1060 nm).
[0086] Typically, a photopolymer plate is processed in alkaline developer having a pH >
10 (see above) and subsequently gummed. Alternatively, the exposed photopolymer plate
can also be developed by applying a gum solution to the coating whereby the non-exposed
areas are removed. Suitable gumming solutions are described in
WO/2005/111727. After the exposure step, the imaged precursor can also be directly mounted on a
press and processed on-press by applying ink and/or fountain solution. Methods for
preparing such plates are disclosed in
WO 93/05446,
US 6,027,857,
US 6,171,735,
US 6,420,089,
US 6,071,675,
US 6,245,481,
US 6,387,595,
US 6,482,571,
US 6,576,401,
US 6,548,222,
WO 03/087939,
US 2003/16577 and
US 2004/13968.
[0087] To protect the surface of the coating of the heat and/or light sensitive printing
plate precursors, in particular from mechanical damage, a protective layer may also
optionally be applied. The protective layer generally comprises at least one water-soluble
binder, such as polyvinyl alcohol, polyvinylpyrrolidone, partially hydrolyzed polyvinyl
acetates, gelatin, carbohydrates or hydroxyethylcellulose, and can be produced in
any known manner such as from an aqueous solution or dispersion which may, if required,
contain small amounts - i.e. less than 5% by weight based on the total weight of the
coating solvents for the protective layer - of organic solvents. The thickness of
the protective layer can suitably be any amount, advantageously up to 5.0 µm, preferably
from 0.1 to 3.0 µm, particularly preferably from 0.15 to 1.0 µm.
[0088] Optionally, the coating may further contain additional ingredients such as surfactants,
especially perfluoro surfactants, silicon or titanium dioxide particles or polymers
particles such as matting agents and spacers.
[0089] Any coating method can be used for applying two or more coating solutions to the
hydrophilic surface of the support. The multi-layer coating can be applied by coating/drying
each layer consecutively or by the simultaneous coating of several coating solutions
at once. In the drying step, the volatile solvents are removed from the coating until
the coating is self-supporting and dry to the touch. However it is not necessary (and
may not even be possible) to remove all the solvent in the drying step. Indeed the
residual solvent content may be regarded as an additional composition variable by
means of which the composition may be optimized. Drying is typically carried out by
blowing hot air onto the coating, typically at a temperature of at least 70°C, suitably
80-150°C and especially 90-140°C. Also infrared lamps can be used. The drying time
may typically be 15-600 seconds.
[0091] The printing plates thus obtained can be used for conventional, so-called wet offset
printing, in which ink and an aqueous dampening liquid are supplied to the plate.
Another suitable printing method uses so-called single-fluid ink without a dampening
liquid. Suitable single-fluid inks have been described in
US 4,045,232;
US 4,981,517 and
US 6,140,392. In a most preferred embodiment, the single-fluid ink comprises an ink phase, also
called the hydrophobic or oleophilic phase, and a polyol phase as described in
WO 00/32705.
[0092] The coatings described herein can also be used as a thermo-resist for forming a pattern
on a substrate by direct imaging techniques, e.g. in a PCB (printed circuit board)
application as described in
US 2003/0003406 A1.
EXAMPLES.
Example 1.
1.1 Preparation of the lithographic substrates.
[0093] A 0.3mm thick AA1050 aluminium sheet was first degreased in NaOH (25 g/1) at 70°C
for 10 seconds and washed in deionised water at room temperature for 5 seconds. Afterwards
the sheet was neutralised in a diluted HCl solution with a pH ≤ 2 at room temperature
for 10 seconds and washed again in deionised water at room temperature for 5 seconds.
Finally the aluminum sheet was potentiostatically (constant voltage) grained at 37°C
using a charge density of 720 C/dm
2 and a current density of 120 A/dm
2. The graining process was carried out in 12.5 g/l HCl solution. The obtained substrate
is the comparative lithographic support PPS-0.
[0094] The invention lithographic supports PPS-1 to PPS-10 were obtained by adding the additives
summarized in Table 1 at two different concentrations (0.0034 M, and 0.034 M).
Table 1: invention printing plate supports.
Printing plate support (PPS) |
Extra additive |
Concentration M |
PPS-1a |
Benzoic acid |
0.0034 |
PPS-1b |
Benzoic acid |
0.034 |
PPS-2a |
3-aminobenzoic acid |
0.0034 |
PPS-2b |
3-aminobenzoic acid |
0.034 |
PPS-3a |
4-aminobenzoic acid |
0.0034 |
PPS-3b |
4-aminobenzoic acid |
0.034 |
PPS-4a |
3-amino-4-hydroxybenzoic acid |
0.0034 |
PPS-4b |
3-amino-4-hydroxybenzoic acid |
0.034 |
PPS-5a |
4-sulfobenzoic acid |
0.0034 |
PPS-5b |
4-sulfobenzoic acid |
0.034 |
PPS-6a |
Benzene-sulphonic acid |
0.0034 |
PPS-6b |
Benzene-sulphonic acid |
0.034 |
PPS-7a |
Aniline-2-sulphonic acid |
0.0034 |
PPS-7b |
Aniline-2-sulphonic acid |
0.034 |
PPS-8a |
Aniline-3-sulphonic acid |
0.0034 |
PPS-8b |
Aniline-3-sulphonic acid |
0.034 |
PPS-9a |
Aniline-4-sulphonic acid |
0.0034 |
PPS-9b |
Aniline-4-sulphonic acid |
0.034 |
PPS-10a |
2-aminophenol-4-sulphonic acid |
0.0034 |
PPS-10b |
2-aminophenol-4-sulphonic acid |
0.034 |
1.2 Determination of pit area and pit volume of the lithographic supports PPS-0 to PPS-10.
[0095] Based on the information obtained from image analysis of interferometer images of
the substrates obtained using an interferometer NT3300 (commercially available from
Veeco Metology Group, Arizona, USA), a computer program, for example MatLAb code,
calculates the mean values of the area and volume of the pits present on the surface
of the grained aluminum supports PPS0 - PPS10. The results are summarized in Table
2.
Table 2: average pit area and volume and standard deviation(σ).
Printing plate support PPS |
Average area µm2 |
Standard deviation σ |
Average volume µm3 |
Standard deviation σ |
PPS-0 Comp. Ex. |
48.1 |
74.9 |
95.9 |
165.5 |
PPS-1a Inv. Ex. |
31.7 |
42.8 |
61.2 |
88.6 |
PPS-1b Inv. Ex. |
16.3 |
22.2 |
22.4 |
36.2 |
PPS-2a Inv. Ex. |
44.9 |
66.9 |
86.4 |
140.1 |
PPS-2b Inv. Ex. |
35.0 |
48.0 |
67.2 |
100.3 |
PPS-3a Inv. Ex. |
44.1 |
65.6 |
87.7 |
142.5 |
PPS-3b Inv. Ex. |
36.9 |
54.1 |
72.1 |
111.7 |
PPS-4a Inv. Ex. |
46.0 |
72.8 |
93.4 |
160.3 |
PPS-4b Inv. Ex. |
38.9 |
57.3 |
78.1 |
125.1 |
PPS-5a Inv. Ex. |
34.7 |
63.6 |
70.8 |
152.5 |
PPS-5b Inv. Ex. |
26.5 |
57.3 |
60.7 |
175.5 |
PPS-6a Inv. Ex. |
45.4 |
71.0 |
94.4 |
164.5 |
PPS-6b Inv. Ex. |
44.8 |
69.5 |
98.6 |
177.9 |
PPS-7a Inv. Ex. |
47.0 |
74.1 |
96.6 |
163.8 |
PPS-7b Inv. Ex. |
29.9 |
39.1 |
57.5 |
81.4 |
PPS-8a Inv. Ex. |
45.9 |
70.5 |
93.2 |
155.3 |
PPS-8b Inv. Ex. |
34.7 |
48.8 |
65.0 |
97.2 |
PPS-9a Inv. Ex. |
48.2 |
73.6 |
- |
169.3 |
PPS-9b Inv. Ex. |
40.5 |
56.8 |
77.8 |
118.2 |
PPS-10a Inv.Ex. |
41.5 |
59.7 |
83.3 |
130.6 |
PPS-10b Inv.Ex. |
34.1 |
47.1 |
65.2 |
97.8 |
[0096] The results show that the addition of the additive to the electrolyte solution, especially
at the concentration of 0.034 M, leads to smaller pits with lower variations in size
as indicated by the smaller standard deviation and results in a more uniform graining
microscopic structure.
Example 2.
2.1 Preparation of the lithographic substrates.
[0097] A 0.3mm thick AA1050 aluminium was first degreased in NaOH (25 g/l) at 70°C for 10
seconds and washed in deionised water at room temperature for 5 seconds. Afterwards
it was neutralised in a diluted HCl solution (pH ≤ 2) at room temperature for 10 seconds
and washed again in deionised water at room temperature for 5 seconds. Finally it
was potentiostatically (constant voltage) grained at 37°C using 960 C/dm
2 and 120 A/dm
2 as charge and current density, respectively. The graining process was carried out
in 12.5 g/l HCl solution. The obtained substrate is the comparative lithographic support
PPS-11.
[0098] The invention lithographic supports PPS-12 to PPS-21 were obtained by adding to the
graining solution containing 12.5 g/l HCl the additives summarized in Table 1 at three
different concentrations (0.00034M, 0.0034M, and 0.034M).
Table 3: invention printing plate supports PPS 12 - PPS 21.
Printing plate support (PPS) |
Extra additive |
Concentration M |
PPS-12a |
Benzoic acid |
0.00034 |
PPS-12b |
Benzoic acid |
0.0034 |
PPS-12c |
Benzoic acid |
0.034 |
PPS-13a |
3-aminobenzoic acid |
0.00034 |
PPS-13b |
3-aminobenzoic acid |
0.0034 |
PPS-13c |
3-aminobenzoic acid |
0.034 |
PPS-14a |
4-aminobenzoic acid |
0.00034 |
PPS-14b |
4-aminobenzoic acid |
0.0034 |
PPS-14c |
4-aminobenzoic acid |
0.034 |
PPS-15a |
3-amino-4-hydroxybenzoic acid |
0.00034 |
PPS-15b |
3-amino-4-hydroxybenzoic acid |
0.0034 |
PPS-15c |
3-amino-4-hydroxybenzoic acid |
0.034 |
PPS-16a |
4-sulfobenzoic acid |
0.00034 |
PPS-16b |
4-sulfobenzoic acid |
0.0034 |
PPS-16c |
4-sulfobenzoic acid |
0.034 |
PPS-17a |
Benzene-sulphonic acid |
0.00034 |
PPS-17b |
Benzene-sulphonic acid |
0.0034 |
PPS-17c |
Benzene-sulphonic acid |
0.034 |
PPS-18a |
Aniline-2-sulphonic acid |
0.00034 |
PPS-18b |
Aniline-2-sulphonic acid |
0.0034 |
PPS-18c |
Aniline-2-sulphonic acid |
0.034 |
PPS-19a |
Aniline-3-sulphonic acid |
0.00034 |
PPS-19b |
Aniline-3-sulphonic acid |
0.0034 |
PPS-19c |
Aniline-3-sulphonic acid |
0.034 |
PPS-20a |
Aniline-4-sulphonic acid |
0.00034 |
PPS-20b |
Aniline-4-sulphonic acid |
0.0034 |
PPS-20c |
Aniline-4-sulphonic acid |
0.034 |
PPS-21a |
2-aminophenol-4-sulphonic acid |
0.00034 |
PPS-21b |
2-aminophenol-4-sulphonic acid |
0.0034 |
PPS-21c |
2-aminophenol-4-sulphonic acid |
0.034 |
2.2 Determination of pit area and pit volume of the lithographic supports PPS-11 to PPS-21.
[0099] Based on the information obtained from image analysis of interferometer images of
the substrates obtained using an interferometer NT3300 (commercially available from
Veeco Metology Group, Arizona, USA), a computer program, for example MatLAb code,
calculates the mean values of the area and volume of the pits present on the surface
of the grained aluminum supports PPS11 - PPS21. The results are summarized in Table
4.
Table 4: average pit area and volume and standard deviation(σ).
Pr. Plate Support (PPS) |
Av.area (µm2) |
σ |
Av.vol.(µm3) |
σ |
PPS-11 Comp. Ex. |
64.5 |
107.7 |
158.1 |
280.3 |
PPS-12a Inv. Ex. |
56.5 |
96.7 |
146.4 |
264.9 |
PPS-12b Inv. Ex. |
46.8 |
84.6 |
119.7 |
229.3 |
PPS-12c Inv. Ex. |
29.4 |
38.9 |
54.9 |
83.4 |
PPS-13a Inv. Ex. |
42.3 |
53.8 |
108.0 |
145.6 |
PPS-13b Inv. Ex. |
46.1 |
64.3 |
117.0 |
171.6 |
PPS-13c Inv. Ex. |
34.7 |
45.0 |
87.1 |
120.3 |
PPS-14a Inv. Ex. |
43.7 |
57.3 |
112.2 |
153.7 |
PPS-14b Inv. Ex. |
45.5 |
63.1 |
126.1 |
186.7 |
PPS-14c Inv. Ex. |
33.3 |
41.7 |
91.2 |
123.4 |
PPS-15a Inv. Ex. |
51.9 |
69.4 |
133.1 |
188.6 |
PPS-15b Inv. Ex. |
48.6 |
71.0 |
123.4 |
191.7 |
PPS-15c Inv. Ex. |
39.9 |
49.0 |
105.2 |
137.5 |
PPS-16a Inv. Ex. |
45.8 |
61.1 |
118.7 |
169.5 |
PPS-16b Inv. Ex. |
60.2 |
99.9 |
160.6 |
287.8 |
PPS-16c Inv. Ex. |
44.2 |
90.9 |
119.9 |
293.8 |
PPS-17a Inv. Ex. |
57.5 |
91.7 |
148.5 |
251.2 |
PPS-17b Inv. Ex. |
55.2 |
76.8 |
142.5 |
210.0 |
PPS-17c Inv. Ex. |
47.6 |
71.8 |
129.5 |
215.1 |
PPS-18a Inv. Ex. |
47.6 |
65.7 |
121.8 |
177.4 |
PPS-18b Inv. Ex. |
45.2 |
62.4 |
126.6 |
187.7 |
PPS-18c Inv. Ex. |
30.3 |
45.0 |
62.8 |
100.6 |
PPS-19a Inv. Ex. |
53.8 |
83.5 |
138.2 |
231.0 |
PPS-19b Inv. Ex. |
43.5 |
59.0 |
110.8 |
159.8 |
PPS-19c Inv. Ex. |
34.0 |
49.6 |
85.5 |
134.2 |
PPS-20a Inv. Ex. |
53.5 |
75.0 |
142.0 |
208.1 |
PPS-20b Inv. Ex. |
46.4 |
61.7 |
121.3 |
170.0 |
PPS-20c Inv. Ex. |
41.9 |
59.4 |
111.9 |
169.3 |
PPS-21a Inv. Ex. |
57.7 |
88.3 |
148.7 |
242.4 |
PPS-21b Inv. Ex. |
62.1 |
98.1 |
166.1 |
278.6 |
PPS-21c Inv. Ex. |
34.3 |
46.2 |
83.3 |
121.8 |
[0100] The results show that the addition of the additive to the electrolyte solution leads
to smaller pits with lower variations in size as indicated by the smaller standard
deviation, and results in a more uniform graining microscopic structure.
Example 3.
3.1 Preparation of the lithographic substrates.
[0101] A 0.3mm thick AA1050 aluminium was first degreased in NaOH (25g/l) at 70°C for 10
seconds and washed in deionised water at RT for 5 seconds. Afterwards it was neutralised
in a diluted HCl solution (pH ≤ 2) at room temperature for 10 seconds and washed again
in deionised water at RT for 5 seconds. Finally it was galvanostatically (constant
current) grained at 37°C using 960C/dm2 and 120A/dm2 as charge and current density,
respectively. The graining process was carried out in 12.5 g/l HCl solution. The obtained
substrate is the comparative lithographic support PPS-22. The invention lithographic
supports PPS-23 to PPS-26 are obtained by adding to the graining solution containing
12.5 g/l HCl the additives summarized in Table 5 at a concentration of 0.034M.
Table 5: invention printing plate supports PPS 23 - PPS 26.
Printing plate support (PPS) |
Extra additive |
Concentration M |
PPS-23 |
Benzoic acid |
0.034 |
PPS-24 |
3-aminobenzoic acid |
0.034 |
PPS-25 |
Benzene-sulphonic acid |
0.034 |
PPS-26 |
Aniline-4-sulphonic acid |
0.034 |
3.2 Determination of pit area and pit volume of the lithographic supports PPS-22 to PPS-26.
[0102] Based on the information obtained from image analysis of interferometer images of
the substrates obtained using an interferometer NT3300 (commercially available from
Veeco Metology Group, Arizona, USA), a computer program, for example MatLAb code,
calculates the mean values of the area and volume of the pits present on the surface
of the grained aluminum supports PPS 22 - PPS 26. The results are summarized in Table
6.
Table 6: average pit area and volume and standard deviation(σ).
Printing plate support (PPS) |
Average area µm2 |
Standard deviation σ |
Average volume µm3 |
Standard deviation σ |
PPS-22 Comp. Ex. |
55.0 |
78.5 |
144.1 |
224.5 |
PPS-23 Inv. Ex. |
26.3 |
35.6 |
50.9 |
78.9 |
PPS-24 Inv. Ex. |
42.1 |
51.8 |
109.0 |
147.9 |
PPS-25 Inv. Ex. |
50.0 |
75.9 |
132.0 |
219.7 |
PPS-26 Inv. Ex. |
37.7 |
52.9 |
85.1 |
132.8 |
[0103] The results show that the addition of the additive to the electrolyte solution leads
to smaller pits with lower variations in size as indicated by the smaller standard
deviation, and results in a more uniform graining microscopic structure.