Apparatus for cutting semiconductor devices

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EP 1 844 913 A3

(12)	EUROPEAN PATENT APPLICATION

(88)	Date of publication A3:
	30.06.2010 Bulletin 2010/26

(43)	Date of publication A2:
	17.10.2007 Bulletin 2007/42

(21)	Application number: 07014806.9

(22)	Date of filing: 22.02.2005

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International Patent Classification (IPC):

B28D 5/00^(2006.01)
B23D 59/02^(2006.01)

B28D 5/02^(2006.01)

(84)	Designated Contracting States:
	AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU MC NL PL PT RO SE SI SK TR

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Priority:

23.02.2004 US 547398 P

(62)	Application number of the earlier application in accordance with Art. 76 EPC:
	05723354.6 / 1722950

(71)	Applicants:
	Towa-Intercon Technology, Inc. Morgan Hill, CA 95037 (US) Koninklijke Philips Electronics N.V. 5621 BA Eindhoven (NL)

(72)	Inventors:
	Mihai, Chris Morgan Hill CA 95037 (US) Khor, Teang K. Milpitas CA 95035 (US) Donker, Marcus Franciscus 6605 Wijchen ZA (NL) Van Gemert, Leo 6652 BC Nijmegen (NL)

(74)	Representative: Schoppe, Fritz et al
	Schoppe, Zimmermann, Stöckeler & Zinkler Patentanwälte Postfach 246 82043 Pullach bei München 82043 Pullach bei München (DE)

(54)	Apparatus for cutting semiconductor devices

(57) An apparatus for cutting semiconductor devices comprises cutting blades (132) for cutting a semiconductor device, generally annular rigid spacers, a fluid reservoir (174), an elongated member and an adjustment mechanism. The rigid spacers separate adjacent ones of the cutting blades, the spacers each having an inner surface at its inner radius and an outer surface at its outer radius, and each contacting the adjacent ones of the cutting blades on first and second substantially planar surfaces each extending substantially from the inner surface to the outer surface. The elongated member is in movable proximity to the cutting blades and in fluid communication with the fluid reservoir and has channels configured to at least partially surround the cutting blades so as to simultaneously direct flow of a fluid from the fluid reservoir onto the cutting edges of the cutting blades and onto the sides of the cutting blades. The adjustment mechanism is configured to move the elongated member so as to adjustably align the channels with the cutting blades.

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