(19)
(11) EP 1 853 406 A1

(12)

(43) Date of publication:
14.11.2007 Bulletin 2007/46

(21) Application number: 06712121.0

(22) Date of filing: 16.01.2006
(51) International Patent Classification (IPC): 
B24B 37/04(2006.01)
B24B 49/16(2006.01)
(86) International application number:
PCT/JP2006/300903
(87) International publication number:
WO 2006/077994 (27.07.2006 Gazette 2006/30)
(84) Designated Contracting States:
DE FR

(30) Priority: 21.01.2005 JP 2005014013

(71) Applicant: EBARA CORPORATION
Ohta-ku, Tokyo 144-8510 (JP)

(72) Inventors:
  • SASAKI, Tatsuya
    a-ku, Tokyo, 1448510 (JP)
  • KAMIOKA, Shintaro
    a-ku, Tokyo, 1448510 (JP)

(74) Representative: Geyer, Ulrich F. et al
WAGNER & GEYER, Patentanwälte, Gewürzmühlstrasse 5
80538 München
80538 München (DE)

   


(54) SUBSTRATE POLISHING METHOD AND APPARATUS