(19)
(11)
EP 1 853 406 A1
(12)
(43)
Date of publication:
14.11.2007
Bulletin 2007/46
(21)
Application number:
06712121.0
(22)
Date of filing:
16.01.2006
(51)
International Patent Classification (IPC):
B24B
37/04
(2006.01)
B24B
49/16
(2006.01)
(86)
International application number:
PCT/JP2006/300903
(87)
International publication number:
WO 2006/077994
(
27.07.2006
Gazette 2006/30)
(84)
Designated Contracting States:
DE FR
(30)
Priority:
21.01.2005
JP 2005014013
(71)
Applicant:
EBARA CORPORATION
Ohta-ku, Tokyo 144-8510 (JP)
(72)
Inventors:
SASAKI, Tatsuya
a-ku, Tokyo, 1448510 (JP)
KAMIOKA, Shintaro
a-ku, Tokyo, 1448510 (JP)
(74)
Representative:
Geyer, Ulrich F. et al
WAGNER & GEYER, Patentanwälte, Gewürzmühlstrasse 5
80538 München
80538 München (DE)
(54)
SUBSTRATE POLISHING METHOD AND APPARATUS