(19)
(11) EP 1 858 080 A3

(12) EUROPEAN PATENT APPLICATION

(88) Date of publication A3:
05.11.2008 Bulletin 2008/45

(43) Date of publication A2:
21.11.2007 Bulletin 2007/47

(21) Application number: 06026677.2

(22) Date of filing: 22.12.2006
(51) International Patent Classification (IPC): 
H01L 23/495(2006.01)
H01L 23/552(2006.01)
 H01L 23/433(2006.01)
(84) Designated Contracting States:
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
Designated Extension States:
AL BA HR MK RS

(30) Priority: 16.05.2006 US 800433 P
05.07.2006 US 480579

(71) Applicant: Broadcom Corporation
Irvine, CA 92617 (US)

(72) Inventors:
  • Zhao, Sam Ziqun
    Irvine, California 92618-7013 (US)
  • Khan, Rezaur Rahman
    Irvine, California 92618-7013 (US)

(74) Representative: Jehle, Volker Armin 
Bosch Graf von Stosch Jehle Patentanwaltsgesellschaft mbH Flüggenstrasse 13
80639 München
80639 München (DE)

   


(54) No-lead ic packages having integrated heat spreader for electromagnetic interference (emi) shielding and thermal enhancement


(57) Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in integrated circuit (IC) packages are described. A die-up or die-down package includes an IC die, a die attach pad, a heat spreader cap coupled to the die attach pad defining a cavity, and one or more peripheral rows of leads surrounding the die attach pad. The leads do not protrude substantially from the footprint of the encasing structure. The die attach pad and the heat spreader cap defines an encasing structure that substantially encloses the IC die, and shields EMI emanating from and radiating towards the IC die. The encasing structure also dissipates heat generated by the IC die during operation.







Search report