(19)
(11)
EP 1 858 950 A1
(12)
(43)
Date of publication:
28.11.2007
Bulletin 2007/48
(21)
Application number:
06714350.3
(22)
Date of filing:
16.02.2006
(51)
International Patent Classification (IPC):
C08G
59/42
(2006.01)
H01L
23/00
(2006.01)
C08G
59/20
(2006.01)
C08L
63/00
(2006.01)
(86)
International application number:
PCT/JP2006/303210
(87)
International publication number:
WO 2006/088230
(
24.08.2006
Gazette 2006/34)
(84)
Designated Contracting States:
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
(30)
Priority:
21.02.2005
JP 2005043969
(71)
Applicant:
SHOWA DENKO KABUSHIKI KAISHA
Tokyo 105-8518 (JP)
(72)
Inventors:
MIYAJIMA, Yoshio
hioji-shi, Tokyo, 1930822 (JP)
WADA, Tetsuo
hioji-shi, Tokyo, 1930822 (JP)
NAKAMURA, Ayako
hioji-shi, Tokyo, 1930822 (JP)
(74)
Representative:
Strehl Schübel-Hopf & Partner
Maximilianstrasse 54
80538 München
80538 München (DE)
(54)
THERMOSETTING COMPOSITION FOR SOLDER RESIST AND CURED PRODUCT THEREOF