(19)
(11) EP 1 858 950 A1

(12)

(43) Date of publication:
28.11.2007 Bulletin 2007/48

(21) Application number: 06714350.3

(22) Date of filing: 16.02.2006
(51) International Patent Classification (IPC): 
C08G 59/42(2006.01)
H01L 23/00(2006.01)
C08G 59/20(2006.01)
C08L 63/00(2006.01)
(86) International application number:
PCT/JP2006/303210
(87) International publication number:
WO 2006/088230 (24.08.2006 Gazette 2006/34)
(84) Designated Contracting States:
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR

(30) Priority: 21.02.2005 JP 2005043969

(71) Applicant: SHOWA DENKO KABUSHIKI KAISHA
Tokyo 105-8518 (JP)

(72) Inventors:
  • MIYAJIMA, Yoshio
    hioji-shi, Tokyo, 1930822 (JP)
  • WADA, Tetsuo
    hioji-shi, Tokyo, 1930822 (JP)
  • NAKAMURA, Ayako
    hioji-shi, Tokyo, 1930822 (JP)

(74) Representative: Strehl Schübel-Hopf & Partner 
Maximilianstrasse 54
80538 München
80538 München (DE)

   


(54) THERMOSETTING COMPOSITION FOR SOLDER RESIST AND CURED PRODUCT THEREOF