(19)
(11) EP 1 859 475 B8

(12) CORRECTED EUROPEAN PATENT SPECIFICATION
Note: Bibliography reflects the latest situation

(15) Correction information:
Corrected version no 1 (W1 B1)

(48) Corrigendum issued on:
15.07.2015 Bulletin 2015/29

(45) Mention of the grant of the patent:
20.05.2015 Bulletin 2015/21

(21) Application number: 06737697.0

(22) Date of filing: 09.03.2006
(51) International Patent Classification (IPC): 
B81C 1/00(2006.01)
H01L 21/30(2006.01)
H01L 29/82(2006.01)
 H01L 21/00(2006.01)
H01L 27/14(2006.01)
H01L 23/48(2006.01)
(86) International application number:
PCT/US2006/008543
(87) International publication number:
WO 2006/101769 (28.09.2006 Gazette 2006/39)

(54)

METHOD OF FABRICATION OF AL/GE BONDING IN A WAFER PACKAGING ENVIRONMENT AND A PRODUCT PRODUCED THEREFROM

VERFAHREN ZUR HERSTELLUNG VON AL/GE-BINDUNG IN EINER WAFERVERKAPSELUNGSUMGEBUNG UND DARAUS HERGESTELLTES PRODUKT

PROCEDE DE FABRICATION D'UNE LIAISON AL/GE DANS UN ENVIRONNEMENT D'EMBALLAGE DE TRANCHES ET PRODUIT FABRIQUE A PARTIR DE CE PROCEDE

(84) Designated Contracting States:
DE FR IT

(30) Priority: 18.03.2005 US 84296

(43) Date of publication of application:
28.11.2007 Bulletin 2007/48

(60) Divisional application:
15161041.7

(73) Proprietor: InvenSense, Inc.
San Jose, CA 95110 (US)

(72) Inventors:
  • NASIRI, Steven, S.
    Saratoga, California 95070 (US)
  • FLANNERY, Anthony, Francis, Jr.
    Los Gatos, California 95030 (US)

(74) Representative: Brookes Batchellor LLP 
1 Boyne Park
Tunbridge Wells Kent TN4 8EL
Tunbridge Wells Kent TN4 8EL (GB)


(56) References cited: : 
WO-A1-03/038449
US-A- 5 249 732
US-B1- 6 199 748
 WO-A2-02/42716
US-A- 5 693 574
   
       
    Note: Within nine months from the publication of the mention of the grant of the European patent, any person may give notice to the European Patent Office of opposition to the European patent granted. Notice of opposition shall be filed in a written reasoned statement. It shall not be deemed to have been filed until the opposition fee has been paid. (Art. 99(1) European Patent Convention).