(19)

(11)

EP 1 861 257 A1

(12)

(43) Date of publication: 05.12.2007 Bulletin 2007/49 (21) Application number: 05711222.9 (22) Date of filing: 01.03.2005

(51) International Patent Classification (IPC):  B41J 13/10(2006.01) (86) International application number: PCT/SG2005/000064 (87) International publication number: WO 2006/093465 (08.09.2006 Gazette 2006/36)

(84) Designated Contracting States: DE FR GB (71) Applicant: Hewlett-Packard Development Company, L.P. Houston, TX 77070 (US)	(72) Inventors: CHU, Tzy Woei 119960 Singapore (SG) TU, Tung-Wen Shenkeng Shiang, 222 Taipei (TW) (74) Representative: Pingree, Oliver Norman et al Williams Powell Morley House 26-30 Holborn Viaduct London EC1A 2BP London EC1A 2BP (GB)