Hard film and method of manufacturing the same

Description

[0001] The present invention relates to a hard film, which is formed on a surface of a cutting tool such as a tip, a drill, and an end mill, and a surface of a plastic working tool such as a forging die and a punch for improving wear resistance of the tools, and relates to a method useful for manufacturing such a hard film.

[0002] Usually, coating of a hard film of TiN, TiCN, TiAlN or the like has been performed for the purpose of improving wear resistance of a cutting tool using sintered hard alloy, cermet, or high speed tool steel as a base material. In particular, since a composite nitride of Ti and Al (hereinafter, abbreviated as "TiAlN") exhibits excellent wear resistance as disclosed in Japanese Patent No. 2644710, a film of the composite nitride is increasingly used for a cutting tool for cutting a very hard material (work material) such as a high speed cutting material or hardened steel in place of a film including nitride (TiN) or carbonitride (TiCN) of Ti.

[0003] However, a film further improved in wear resistance is now required with recent increase in hardness of work material or increase in cutting speed.

[0004] The hard film is further required to have oxidation resistance under high temperature. In the TiAlN film as above, oxidation resistance is comparatively high, and oxidation starts near 800 to 900°C, however, there is a difficulty that deterioration of the film tends to progress under a more severe environment. Therefore, a hard film is proposed, in which the TiAlN·film is added with Cr, thereby the concentration of Al is increased while keeping a cubic crystal structure with high hardness, and consequently oxidation resistance is further improved (e.g., JP-A-2003-71610). Moreover, a hard film is proposed, in which oxidation resistance is further improved by adding Si or B into a TiCrAlN film (e.g., JP-A-2003-71611), or a hard film is proposed, in which oxidation resistance is further improved by adding Nb, Si or B into a CrAlN film (e.g., WO2006-005217).

[0005] EP143416 discloses a coating comprising a nitride layer contacting the substrate surface and having a composition of 5-30 at. % titanium, 10-40 at. % aluminum, 1-40 at. % chromium, 0-3 at. % yttrium and 40-60 at. % nitrogen.

[0006] However, the hard films proposed so far cannot be regarded to be excellent in wear resistance and oxidation resistance, and actually, further improvement in properties is desired.

[0007] In view of foregoing, it is desirable to provide a hard film that is obviously excellent in wear resistance, and exhibits excellent oxidation resistance even under a condition that hot heat generation easily occurs due to friction heating, consequently exhibits excellent properties compared with a usual hard-film including TiAlN, TiCrAlN, TiCrAlSiBN, CrAlSiBN, or NbCrAlSiBN, and provide a method useful for manufacturing such a hard film.

[0008] A hard film of an embodiment of the invention is summarized in that it consists of (M)_aCr_bAl_cSi_dB_eY_fZ (however, M is at least one element selected from a group 4B element, a group 5B element, and a group 6B element (except for Cr) in the periodic table, and Z shows one of N, CN, NO and CNO), wherein


and d ≥ 0.03 and/or e ≥ 0.03, 0<a≤0.3, 0.05≤b≤0.4, 0.4≤c≤0.8, 0≤d≤0.2, 0≤e≤0.2, and 0.01≤f≤0.1, (a, b, c, d, e and f show atomic ratios of M, Cr, Al, Si, B and Y respectively).

[0009] Moreover, such a subject can be achieved by a hard film consisting of Cr_bAl_cSi_dB_eY_fZ (however, Z shows one of N, CN, NO and CNO), wherein


0.2≤b≤0.5, 0.4≤c≤0.7, 0≤5d≤0.2, 0≤e≤0.2, and 0.01≤f≤0.1 (however, d+e>0),
(b, c, d, e and f show atomic ratios of Cr, Al, Si, B and Y respectively).

[0010] As a preferable mode of the hard film of an embodiment of the invention, a hard film is given, in which hard films as above (within a composition range shown as above) are alternately stacked with compositions being different from each other, and thickness of each layer is between 5 nm and 200 nm.

[0011] When the hard film as above is manufactured, the hard film is preferably formed by a cathode discharge arc ion plating method.

[0012] The hard film of an embodiment of the invention is in a hard film structure as expressed by a certain expression, thereby a hard film can be achieved, in which wear resistance is obviously excellent, and deterioration in property due to oxidation is not caused even under a condition that hot heat generation easily occurs due to friction heating. Such a hard film is extremely useful as a hard film formed on surfaces of base materials of various cutting tools, or plastic working tools such as a forging die and a punch.

[0013] Fig. 1 is a schematic illustrative diagram showing a configuration example of an arc ion plating apparatus (AIP apparatus) for manufacturing the hard film of an embodiment of the invention.

[0014] The inventors made investigation from various points of view to further improve high-temperature resistance (oxidation resistance) of a hard film. As a result, they found that Cr was contained as an indispensable component, and Y was contained in place of Si or B being regarded to be effective for improving oxidation resistance, or contained in addition to Si or B, leading to extreme improvement in oxidation resistance of a hard film, consequently completed an embodiment of the invention. Hereinafter, a reason for selecting each element in the hard film of an embodiment of the invention, and a reason for limiting a composition range of each element are described.

[0015] The hard film of an embodiment of the invention is expressed by the following general expression (1). A reason for selecting each element in the hard film of an embodiment of the invention, and a reason for limiting a composition range of each element are described.

        (M)_aCr_bAl_cSi_dB_eY_fZ     (1)

(a, b, c, d, e and f show atomic ratios of M, Cr, Al, Si, B and Y respectively, and Z shows one of N, CN, NO and CNO).

[0016] A metal element M is at least one element except for Cr selected from a group 4B element, a group 5B element, and a group 6B element (Ti, Zr, Hf, V, Nb, Ta, Mo and W) in the periodic table. The metal element exhibits an operation of forming a nitride (MN) having high hardness in a film, and thus increasing film hardness. However, since nitrides of the elements are bad in oxidation resistance compared with CrN, large content of the metal element M reduces oxidation resistance of a film. Therefore, an upper limit of an atomic ratio of M in the film needs to be 0.3 (that is, when a+b+c+d+e+f=1 is given, a needs to be 0.3 or less).

[0017] Moreover, when the metal element M is not contained at all, hardness tends to be slightly decreased, therefore a lower limit of the metal element is more than 0 (that is, a>0). A preferable range of the metal element M is 0.02 to 0.2 in the light of oxidation resistance and hardness. As the metal element M, Ti or Hf is preferably selected in the light of hardness, and Nb is preferably selected in the light of oxidation resistance and hardness.

[0018] The hard film of an embodiment of the invention contains Cr as an indispensable component. Cr is a necessary element for configuring the film to improve oxidation resistance of the film, and dissolve AlN in a CrN nitride of a cubic rocksalt type to form metastable cubic AlN. A lower limit of an atomic ratio of Cr needs to be 0.05 (that is, a subscript b is not less than 0.05) in the hard film so that Cr exhibits such effects. However, CrN is low in hardness compared with the nitrides of M, and excessive content of Cr may cause reduction in hardness of a film. Therefore, an upper limit of Cr is 0.4 (that is, b≤0.4). A preferable range of the Cr content is in a range of 0.1 to 0.25 in an atomic ratio (0.1≤b≤0.25).

[0019] Al is an element necessary for improving oxidation resistance of a hard film, and needs to be contained in an atomic ration of 0.4 or more (that is, c≥0.4) to exhibit such an effect. However, since a stable phase of AlN primarily includes a hexagonal structure, when Al is excessively contained and significantly exceeds the total sum of added amount of metal elements M and Cr, transfer into a hexagonal structure occurs, resulting in softening of a film. Therefore, an upper limit of an atomic ratio of the content of Al needs to be 0.8 (that is, c≤0.8). A preferable range of the Al content is 0.5 to 0.6 in an atomic ratio (0.5≤c≤0.6).

[0020] Si, B and Y are added in a film with an upper limit of 0.2 (0.1 in the case of Y) in an atomic ratio to improve oxidation resistance respectively. Since Y has the largest effect of improving oxidation resistance among them, Y needs to be added in an atomic ratio of 0.01 or more (that is, f≥0.01).

[0021] Addition of Si and B provides an operation of fining crystal grains of a film and thus increasing hardness, in addition, when Si and B are contained together with Y, an effect of further improving oxidation resistance is provided. Si and B are added in an atomic ratio of 0.03 or more (that is, d≥0.03, e≥0.03) to exhibit such effects respectively. However, since addition of the elements tends to cause a film to be transferred into an amorphous or hexagonal structure, upper limits of them are specified to be 0.2 in Si, 0.02 in B, and 0.1 in Y (that is, d≤0.2, e≤0.2, and f≤0.1) respectively. As a more preferable range, Si of 0.03 to 0.07, B of 0.05 to 0.1, and Y of 0.02 to 0.05 are given.

[0022] The hard film of an embodiment of the invention may include any form of a nitride, carbonitride, nitrogen oxide, and carbon-nitrogen oxide (Z is N, CN, NO or CNO in the general expression (1)). However, preferably, the form is essentially a nitride, and a ratio (atomic ratio) of N in Z is 0.5 or more. More preferably, the ratio is 0.8 or more. As an element other than N, C or O is contained as the remainder.

[0023] In an application requiring more improved oxidation resistance, a composition of the hard film contains Cr and Y as indispensable components as expressed in the following general expression (2), thereby stability can be added at further high temperature.

        Cr_bAl_cSi_dB_eY_fZ     (2),

(b, c, d, e and f show atomic ratios of Cr, Al, Si, B and Y respectively, and Z shows one of N, CN, NO and CNO).

[0024] In such a hard film, since the metal element M being a stabilizing element of the cubic rocksalt structure is not present, a crystal structure is easily transferred into a hexagonal structure in a case of some Al content. Therefore, the content of Cr needs to be 0.2 or more (that is, b≥0.2) to stabilize a cubic AlN compound. However, when Cr is excessively contained, hardness is decreased even if a crystal structure is cubic. Therefore, an upper limit of the content of Cr needs to be 0.5 (that is, b≤0.5). A preferable range of the Cr content is about 0.3 to 0.4 in an atomic ratio (that is, 0.3≤b≤0.4).

[0025] Regarding the Al content in the hard film, since the hexagonal structure is easily formed in the hard film, an upper limit of the Al content is specified to be 0.7. More preferably, it is 0.5 to 0.6 (that is, 0.5≤c≤0.6). Regarding Si, B and Y, a specified range and a preferable range are the same as in the hard film expressed in the general expression (1) . However, at least one of Si and B needs to be contained (that is, d+e>0) in the light of fining of film crystal grains and increase in hardness by adding Si or B.

[0026] The hard film of an embodiment of the invention needs not be wholly configured by a film having a single composition, but may be a hard film of a stacked type in which at least one or two layers are stacked, the layers having different compositions from one another in the composition range of the general expression (1) or (2). As an example (combination) of such a stacked-type hard film, TiCrAlSiYN/NbCrAlYN, TiCrAlBYN/HfCrAlYN and the like are given. In these examples, compositions of the films are made different from each other by changing kinds of elements configuring the respective films. However, even in a combination of the same element, compositions can be made different from each other by differing composition ranges from each other.

[0027] When the films different in composition or element are stacked as above, since lattice constants of the films are different from each other, lattice distortion is induced between layers, leading to further increase in hardness of the films . In the case that the films are stacked, thickness of each layer is preferably 5 nm or more, and when the thickness is less than 5 nm, the films exhibits the same performance as that of a film having a single structure. When thickness of each layer exceeds 200 nm, since the number of stacking is decreased because thickness of about several micrometers is required for a cutting tool or other tools, the number of interfaces in which distortion is stored is decreased, consequently the effect of increase in hardness is hardly obtained. More preferably, thickness of each layer is about 10 to 100 nm.

[0028] While a method of manufacturing the hard film of an embodiment of the invention is not particularly limited, a PVD method using a solid target is recommended for the method. In particular, the cathode discharge arc ion plating method (AIP method) is preferably used. In formation of the hard film of a multi-component system as above, if a sputtering method is used, difference in target composition is increased between a target composition and a film composition. However, such a difficulty of difference in composition is substantially eliminated in the AIP method. Moreover, there is an advantage that since an ionization ratio of a target element is high in the AIP method, a formed film is tight and high in hardness.

[0029] In the hard film of an embodiment of the invention, the hard film is provided as a stacked film in which films are stacked, the films having compositions as shown in the general expression (1) or (2) respectively, thereby film performance can be improved. However, the stacked film can be configured by combining a film having the relevant composition and a hard film having a composition other than the film composition as shown in the general expression (1) or (2) . For example, the film can be configured by stacking a film including a nitride, carbide, or carbonitride of at least one element selected from a group including a group 4B element, a group 5B element, and a group 6B element in the periodic table, and Al, Si, and B, and a film having a composition as shown in the general expression (1) or (2). As such a film, a film of TiAl(CN), TiCrAl(CN), CrAl(CN), TiSi(CN), TiVAl(CN), TiNbAl(CN), NbCrAl(CN) or the like is exemplified.

[0030] Fig. 1 is a schematic illustrative diagram showing a configuration example of an arc ion plating apparatus (AIP apparatus) for manufacturing the hard film of an embodiment of the invention. In the apparatus shown in Fig. 1, a turntable 2 is disposed within a vacuum chamber 1, and four rotation tables 3 are symmetrically attached to the turntable 2. Each rotation table 3 is mounted with a body to be treated (base material) 5. Around the turntable 2, a plurality of (two in Fig. 1) arc evaporation sources 6a, 6b (cathode side), and heaters 7a, 7b, 7c and 7d are disposed.. Arc voltage sources 8a, 8b are disposed at respective sides of the evaporation sources 6a, 6b to evaporate the sources respectively.

[0031] In the figure, 11 is a filament-type ion source, 12 is an AC power supply for filament heating, and 13 is a DC power supply for discharge, wherein a filament (made of W) is heated by current from the AC power supply for filament heating 12, then emitted thermoelectrons are introduced into the vacuum chamber by the DC power supply for discharge 13, so that plasma (Ar) is generated between the filament and the chamber to generate Ar ions. Cleaning of the body to be treated (base material) is performed using the Ar ions. The inside of the vacuum chamber is configured in such a way that the inside is evacuated to a vacuum by a vacuum pump P, and various kinds of deposition gas is introduced through a mass flow controller 9a, 9b, 9c or 9d.

[0032] Targets having various compositions are used for the respective evaporation sources 6a, 6b. The turntable 2 and the rotation tables 3 are rotated while the targets are evaporated in a deposition gas (C-source-contained gas, O₂ gas, and N-source-contained gas, or diluted gas of them with inert gas) using the filament-type ion source 11, thereby hard films can be formed on a surface of the body to be treated 5. In the figure, 10 is a bias voltage source provided for applying a negative voltage (bias voltage) to the base materials 5.

[0033] The hard film of the stacked type can be achieved (1) by using a plurality of different arc evaporation sources 6a, 6b, in addition, it can be achieved (2) by periodically changing a negative voltage (bias voltage) applied to the body to be treated 5, or (3) by changing an atmospheric gas. In particular, a ratio of the C-source-contained gas in the atmospheric gas is periodically changed to stack at least two kinds of films having values of carbon in the expression (1) being different from each other.

[0034] Control of a period of the hard film of the stacked type (repetition period of stacking) and thickness of each layer can be achieved by controlling rotation frequencies of the turntable and rotation tables and input power for the respective evaporation sources (proportional to the amount of evaporation) in the (1), time for applying the bias voltage in the (2), and time for introducing the atmospheric gas in the (3).

[0035] As a base material for forming the hard film of an embodiment of the invention, sintered hard alloy, cermet, cBN or the like is given as an applicable tool material, the hard film can be applied to an iron-based alloy material such as cold-worked tool steel, hot-worked tool steel, or high speed tool steel.

[0036] While the invention is described more specifically with examples hereinafter, it will be appreciated that the invention is not restricted by the following examples, and the invention can be obviously carried out with being appropriately altered or modified within a scope suitable for the content described before and after, and all of such alterations or modifications are encompassed within a technical scope of the invention.

Example 1

[0037] A target containing M, Cr, Al, Si, B and Y in various ratios was disposed on the arc evaporation source 6a of the apparatus (AIP apparatus) shown in Fig. 1, and a super-alloy tip, a super-alloy boll end mill (10 mm in diameter, two flute) as the bodies to be treated 5, and a platinum foil for an oxidation test (30 mm in length, 5 mm in width, and 0.1 mm in thickness) were mounted on the rotation tables 3, then the inside of the vacuum chamber was evacuated into a vacuum. Then, the bodies to be treated 5 were heated to a temperature of 550°C by the heaters 7a, 7b, 7c and 7d disposed within the vacuum chamber 1, and subjected to cleaning using Ar ions (Ar, pressure of 0.6 Pa, voltage of 500 V, and time of 5 min), and then nitrogen gas (N₂ gas) was introduced to increase pressure in the chamber 1 to 4.0 Pa to start arc discharge, consequently hard films 3 µm in thickness were formed on surfaces of the bodies to be treated 5. When C or O was contained in the film, methane gas (CH₄ gas) or oxygen gas (O₂ gas) was introduced into the deposition apparatus in a range of flow ratio to N₂ gas of 5 to 50 in volume percent. During deposition, a bias voltage of 20 to 100 V was applied to a substrate such that electric potential of the bodies to be treated 5 is negative with respect to ground potential.

[0038] For obtained hard films, metal compositions in the films were measured by EPMA, and Vickers hardness (load of 0.25 N, and holding time of 15 sec) was investigated. Moreover, crystal structures of the films, and characteristics (oxidation start temperature, and wear width) of the films were evaluated.

Analysis Condition of Crystal Structure

[0039] Evaluation of the crystal structures were performed by X-ray diffraction in θ-2θ using an X-ray diffraction apparatus manufactured by Rigaku Corporation. At that time, X-ray diffraction for a cubic structure was performed using a CuKα radiation source, and peak intensity for (111) face was measured near 2θ=37.78°, peak intensity for (200) face near 2θ=43.9°, and peak intensity for (220) face near 2θ=63.8°. X-ray diffraction for a hexagonal structure was performed using the CuKα radiation source, and peak intensity for (100) face was measured near 2θ=32° to 33°, peak intensity for (102) face near 2θ=48° to 50°, and peak intensity for (110) face near 2θ=57° to 58°. A crystal structure index X was calculated using values of them according to the following expression (3), and crystal structures of the films were determined according to the following standard.


wherein IB(111), IB(200) and IB(220) show peak intensity of respective faces of the cubic structure. IH(100), IH (102) and IH (110) show peak intensity of respective faces of the hexagonal structure.

[0040] A case of the index X of 0.9 or more: cubic crystal structure (in the following tables, described as B1)

[0041] A case of the index X of not less than 0.1 and less than 0.9: mixed type (in the following tables, described as B1+B4)

[0042] A case of the index X of less than 0.1 : hexagonal crystal structure (in the following tables, described as B4)

Oxidation Start Temperature

[0043] A platinum sample obtained in the example (platinum foil having a hard film formed thereon) was heated from room temperature at a heating rate of 5 °C/min in artificial dry air, and change in mass of the sample was investigated by a thermobalance. Oxidation start temperature was determined from an obtained mass increase curve.

[0044] Using a test end mill obtained in the example (ball end mill made of sintered hard alloy having a hard film formed on a surface thereof), cutting was performed at the following cutting conditions with SKD 11 (HRC60) as a work material, then an edge was observed by a light microscope to measure wear width of a boundary portion between a cutting face and a flank.

Cutting speed: 150 m/min

Cutter feed: 0.04 mm/cutter

Axial cutting depth: 4.5 mm

Radial cutting depth: 0.1 m/s

Cutting length: 50 m

down cut, dry cut, and air blow only

[0045] Results of them are shown in the following Tables 1 and 2 together with the compositions of the hard films.

Table 1

Sample No.	Hard film (atomic ratio)										Crystal structure	Hardness (HV)	Oxidation start temperature (°C)	Amout of wear (µm)	Remarks
	M	Cr	Al	Si	B	Y	Sum	C	N	O
1	0. 4(Ti)	0	0. 6	0	0	0	1	0	1	0	B1	2800	850	120	Usual example
2	0. 2(Ti)	0. 15	0. 65	0	0	0	1	0	1	0	B1	3000	1000	70	Usual example
3	0. 2(Ti)	0. 2	0. 55	0. 05	0	0	1	0	1	0	B1	2900	1100	50	Usual example
4	0	0. 4	0. 55	0. 05	0	0	1	0	1	0	B1	2900	1100	80	Usual example
5	0. 45(Ti)	0. 05	0. 50	0	0	0	1	0	1	0	B1	2900	1000	90	Usual example La 0.001
6	0. 35(Ti)	0	0. 60	0. 05	0	0. 001	1	0	1	0	B1	2800	1100	80	Effect of Y
7	0. 15(Ti)	0. 24	0. 60	0	0	0. 01	1	0	1	0	B1	3200	1100	45
8	0. 13(Ti)	0. 24	0. 61	0	0	0. 02	1	0	1	0	B1	3300	1150	30
9	0. 14(Ti)	0. 24	0. 57	0	0	0. 05	1	0	1	0	B1	3200	1200	30
10	0. 14(Ti)	0. 24	0. 52	0	0	0. 10	1	0	1	0	B1	3200	1150	35
11	0. 11(Ti)	0. 24	0. 50	0	0	0. 15	1	0	1	0	B4	2700	1100	60
12	0. 13(Ti)	0. 22	0. 60	0. 03	0	0. 02	1	0	1	0	B1	3300	1250	25	Effect of Si
13	0. 14(Ti)	0. 22	0. 55	0. 07	0	0. 02	1	0	1	0	B1	3300	1300	20
14	0. 13(Ti)	0. 23	0. 50	0. 12	0	0. 02	1	0	1	0	B1	3250	1300	30
15	0. 11(Ti)	0. 17	0. 50	0. 20	0	0. 02	1	0	1	0	B1	3200	1350	45
16	0. 10(Ti)	0. 13	0. 50	0. 25	0	0. 02	1	0	1	0	B4	2800	1100	65
17	0. 13(Ti)	0. 22	0. 61	0	0. 02	0. 02	1	0	1	0	B1	3250	1250	25	Effect of B
18	0. 13(Ti)	0. 22	0. 58	0	0. 05	0. 02	1	0	1	0	B1	3250	1250	25
19	0. 13(Ti)	0. 22	0. 51	0	0. 12	0. 02	1	0	1	0	B1	3300	1150	30
20	0. 13(Ti)	0. 15	0. 50	0	0. 20	0. 02	1	0	1	0	B4+B1	3200	1150	45
21	0. 10(Ti)	0. 13	0. 50	0	0. 25	0. 02	1	0	1	0	B4	2800	1100	65
22	0. 13(Ti)	0. 22	0. 58	0. 03	0. 02	0. 02	1	0	1	0	B1	3350	1250	20	Effect of Si and B
23	0. 25(Ti)	0. 37	0. 35	0	0	0. 03	1	0	1	0	B1	2900	1050	55	Eftect of Al
24	0. 25(Ti)	0. 32	0. 40	0	0	0. 03	1	0	1	0	B1	3100	1100	30
25	0. 20(Ti)	0. 27	0. 50	0	0	0. 03	1	0	1	0	B1	3200	1250	25
26	0. 17(Ti)	0. 20	0. 60	0	0	0. 03	1	0	1	0	B1	3300	1250	25
27	0. 12(Ti)	0. 15	0. 70	0	0	0. 03	1	0	1	0	B1	3150	1250	30
28	0. 07(Ti)	0. 10	0. 80	0	0	0. 03	1	0	1	0	B4+B1	3100	1250	45
29	0. 05(Ti)	0. 07	0. 85	0	0	0. 03	1	0	1	0	B4	2800	1250	65

Table 2
Sample No.	Hard film (atomic ratio)										Crystal structure	Hardness (HV)	Oxidation start temperature (°C)	Amount of wear (µm)	Remarks
	M	Cr	Al	Si	B	Y	Sum	C	N	O
30	0. 42(Ti)	0	0. 55	0	0	0. 03	1	0	1	0	B1	2950	1000	70	Effect of Cr
31	0. 32(Ti)	0. 05	0. 6	0	0	0. 03	1	0	1	0	B1	3100	1250	40
32	0. 27(Ti)	0. 1	0. 6	0	0	0. 03	1	0	1	0	B1	3200	1200	30
33	0. 27(Ti)	0. 15	0. 55	0	0	0. 03	1	0	1	0	B1	3250	1200	25
34	0. 17(T)	0. 25	0. 55	0	0	0. 03	1	0	1	0	B1	3200	1150	30
35	0. 12(Ti)	0. 4	0. 45	0	0	0. 03	1	0	1	0	B1	3100	1100	35
36	0. 07(Ti)	0. 5	0. 4	0	0	0. 03	1	0	1	0	B1	2900	1000	85
37	0	0. 4	0. 57	0	0	0. 03	1	0	1	0	B1	2800	1200	80	Effect of M(Ti)
38	0. 05(Ti)	0. 35	0. 57	0	0	0. 03	1	0	1	0	B1	3150	1250	40
39	0. 14(Ti)	0. 25	0. 58	0	0	0. 03	1	0	1	0	B1	3200	1250	30
40	0. 2(Ti)	0. 2	0. 57	0	0	0. 03	1	0	1	0	B1	3300	1200	25
41	0. 3(Ti)	0. 12	0. 55	0	0	0. 03	1	0	1	0	B1	3350	1200	30
42	0. 4(Ti)	0. 07	0. 5	0	0	0. 03	1	0	1	0	B1	3100	1000	67
43	0. 15(Zr)	0. 25	0. 57	0	0	0. 03	1	0	1	0	B1	3150	1150	40	Effect of kind of M
44	0. 15(Hi)	0. 25	0. 57	0	0	0. 03	1	0	1	0	B1	3200	1200	30
45	0. 15(V)	0. 25	0. 57	0	0	0. 03	1	0	1	0	B1	3250	1100	35
46	0. 15(Nb)	0. 25	0. 57	0	0	0. 03	1	0	1	0	B1	3350	1300	20
47	0. 15(Ta)	0. 25	0. 57	0	0	0. 03	1	0	1	0	B1	3250	1200	30
48	0. 15(Mo)	0. 25	0. 57	0	0	0. 03	1	0	1	0	B1	3250	1150	35
49	0. 15(W)	0. 25	0. 57	0	0	0. 03	1	0	1	0	B1	3250	1150	35
50	0. 15(Ti0.5Nb0.5)	0. 25	0. 57	0	0	0. 03	1	0	1	0	B1	3300	1250	25
51	0. 15(H0.5Zr0.5)	0. 25	0. 57	0	0	0. 03	1	0	1	0	B1	3250	1200	30
52	0. 15(Ta0.5Nb0.5)	0. 25	0. 57	0	0	0. 03	1	0	1	0	B1	3300	1250	25
53	0. 15(W0.5Hf0.5)	0. 25	0. 57	0	0	0. 03	1	0	1	0	B1	3200	1200	30
54	0. 15(Nb)	0.25	0. 57	0	0	0. 03	1	0	1	0	B1	3350	1250	20	Effect of CNO
55	0. 15(Nb)	0. 25	0. 57	0	0	0. 03	1	0. 1	0. 9	0	B1	3350	1200	20
56	0. 15(Nb)	0. 25	0. 57	0	0	0. 03	1	0. 2	0. 8	0	B1	3350	1200	25
57	0. 15(Nb)	0. 25	0. 57	0	0	0. 03	1	0. 3	0. 7	0	B1	3350	1150	45
58	0. 15(Nb)	0. 25	0. 57	0	0	0. 03	1	0	0. 9	0. 1	B1	3350	1250	20
59	0. 15(Nb)	0. 25	0. 57	0	0	0. 03	1	0	0. 8	0. 2	B1	3350	1250	25
60	0. 15(Nb)	0.25	0. 57	0	0	0. 03	1	0	0. 7	0. 3	B1	3350	1250	30
61	0. 15(Nb)	0.25	0. 57	0	0	0. 03	1	0	0. 6	0. 4	B1	3350	1250	45

[0046] Sample Nos. 12 to 15, 17 to 20, and 22, in the Tables 1 and 2 correspond to hard films satisfying requirements specified in an embodiment of the invention, and the hard films are excellent in hardness, oxidation start temperature, wear width and the like compared with usual hard films (Nos. 1 to 5) and hard films varied from the requirements specified in an embodiment of the invention (Nos. 6 to 11, 16, 21, and 23 to 61).

Example 2

[0047] A target containing Cr, Al, Si, B and Y in various ratios was disposed on the arc evaporation source 6a of the apparatus (AIP apparatus) shown in Fig. 1, and a super-alloy tip, a super-alloy boll end mill (10 mm in diameter, two flute) as the bodies to be treated 5, and a platinum foil for an oxidation test (30 mm in length, 5 mm in width, and 0.1 mm in thickness) were mounted on the rotation tables 3, then the inside of the vacuum chamber was evacuated into a vacuum. Then, the bodies to be treated 5 were heated to a temperature of 550°C by the heaters 7a, 7b, 7c and 7d disposed within the vacuum chamber 1, and subjected to cleaning using Ar ions (Ar, pressure of 0.6 Pa, voltage of 500 V, and time of 5 min), and then nitrogen gas (N₂ gas) was introduced to increase pressure in the chamber 1 to 4.0 Pa to start arc discharge, consequently hard films 3 µm in thickness were formed on surfaces of the bodies to be treated 5. When C or O was contained in the film, methane gas (CH₄ gas) or oxygen gas (O₂ gas) was introduced into the deposition apparatus in a range of flow ratio to N₂ gas of 5 to 50 in volume percent. During deposition, a bias voltage of 20 to 100 V was applied to a substrate such that electric potential of the bodies to be treated 5 is negative with respect to ground potential.

[0048] For obtained hard films, metal compositions in the films were measured by EPMA, and Vickers hardness (load of 0.25 N, and holding time of 15 sec) was investigated. Similarly as in the example 1, crystal structures of the films, and characteristics (oxidation start temperature, and wear width) of the films were evaluated.

[0049] Results of them are collectively shown in the following Table 3. It is known that hard films satisfying the requirements specified in an embodiment of the invention (sample Nos. 66 to 69, 71 to 74, 77 to 80, 85 to 87, and 89 to 91) are excellent in hardness, oxidation start temperature, wear width and the like compared with usual hard films (sample Nos. 62 to 65) and hard films varied from the requirements specified in an embodiment of the invention (sample Nos. 70, 75, 76, 81 to 84, and 88).

Table 3
Sample No.										Crystal structure	Hardness (HV)	Oxidation start temperature (°C)	Amount of wear (µm)	Remarks
	Cr	Al	Si	B	Y	Sum	C	N	O
62	0. 4	0. 6	0	0	0	1	0	1	0	B1	2800	1000	120	Usual example
63	0 .4	0. 5	0. 1	0	0	1	0	1	0	B1	2900	1000	90	Usual example
64	0. 4	0. 5	0. 05	0. 05	0	1	0	1	0	B1	2800	1100	80	Usual example
65	0. 4	0. 58	0	0	0. 02	1	0	1	0	B1	2900	1100	80	Usual example
66	0. 36	0. 6	0. 03	0	0. 01	1	0	1	0	B1	3100	1250	45	Effect of Y
67	0. 34	0. 61	0. 03	0	0. 02	1	0	1	0	B1	3150	1300	31
68	0. 35	0. 57	0. 03	0	0. 05	1	0	1	0	B1	3150	1350	31
69	0. 35	0. 52	0. 03	0	0. 1	1	0	1	0	B1	3150	1350	32
70	0. 32	0. 5	0. 03	0	0. 15	1	0	1	0	B1	2700	1100	60
71	0. 35	0. 6	0. 03	0	0. 02	1	0	1	0	B1	3300	1200	25	Effect of Si
72	0. 36	0. 55	0. 07	0	0. 02	1	0	1	0	B1	3300	1250	23
73	0. 36	0. 5	0. 12	0	0. 02	1	0	1	0	B1	3250	1350	25
74	0. 28	0. 5	0. 2	0	0. 02	1	0	1	0	B1	3200	1250	42
75	0. 23	0. 5	0. 25	0	0. 02	1	0	1	0	B1	2800	1200	65
76	0. 58	0. 35	0 .4	0	0. 03	1	0	1	0	B1	2900	1050	55	Effect of Al
77	0. 53	0. 4	0. 04	0	0. 03	1	0	1	0	B1	3100	1300	30
78	0. 43	0. 5	0. 04	0	0. 03	1	0	1	0	B1	3200	1300	25
79	0. 33	0. 6	0. 04	0	0. 03		0	1	0	B1	3300	1350	24
80	0. 23	0. 7	0. 04	0	0. 03	1	0	1	0	B1	3150	1300	26
81	0. 13	0. 8	0. 04	0	0. 03	1	0	1	0	B4	2900	1250	70
82	0. 08	0. 85	0. 04	0	0. 03	1	0	1	0	B4	2800	1250	85
83	0. 1	0. 85	0. 02	0	0. 03	1	0	1	0	B4	2850	1100	80	Effect of Cr
84	0. 2	0. 7	0. 05	0	0. 03	1	0. 1	0. 9	0	B1	3150	1300	45
85	0. 25	0. 7	0. 02	0	0. 03	1	0. 2	0. 8	0	B1	3200	1250	40
86	0. 4	0. 55	0. 02	0	0. 03	1	0. 3	0. 7	0	B1	3100	1350	26
87	0. 5	0. 45	0. 02	0	0. 03	1	0	0. 9	0. 1	B1	2900	1300	27
88	0. 6	0. 35	0. 02	0	0. 03	1	0	0. 6	0. 4	B1	2900	1100	75
89	0. 34	0. 6	0. 03	0. 01	0. 02	1	0	1	0	B1	3200	1150	27	Effect of Si and B
90	0. 34	0. 6	0. 02	0. 02	0. 02	1	0	1	0	B1	3250	1200	25
91	0. 33	0. 6	0. 02	0. 03	0. 02	1	0	1	0	B1	3150	1200	29

Example 3

[0050] The plurality of arc evaporation sources 6a, 6b were installed in the apparatus (AIP apparatus) shown in Fig. 1, and stacked films including films having compositions as shown in the following Table 4 were formed. At that time, the plurality of targets 6a, 6b were simultaneously discharged, and the base materials (bodies to be treated 5) were mounted on the rotating rotation tables 3 such that the base materials alternately pass through respective fronts of the arc evaporation sources 6a, 6b, thereby the stacked films were formed. For a stacked film having a long stacking period, the arc evaporation sources 6a, 6b were alternately discharged to form the stacked film. Other film formation conditions were the same as those in the examples 1 and 2.

[0051] For obtained hard films, metal compositions in the films, Vickers hardness, crystal structures of the films, and characteristics of the films were evaluated in the same way as in the examples 1 and 2.

[0052] Results of them are collectively shown in the following Table 4. It is known that all samples (sample Nos. 92 to 102) are excellent in hardness, oxidation start temperature, wear width and the like.

	Table 4
Sample No.	Layer A		Layer B		Number of stacking	Total thickness (nm)	Crystal structure	Hardness (HV)	Oxidation start temperature (°C)	Amout of wear (µm)
	Kind	Thickness (nm)	Kind	Thickness (nm)
92	(Ti0.2Cr0.2Al0.57Y0.03)N	2	(Ti0.17Cr0.2Al0.5Si0.1Y0.03)N	2	750	3000	B1	3200	1250	30
93	(Ti0.2Cr0.2Al0.57Y0.03)N	5	(Ti0.17Cr0.2Al0.5Si0.1Y0.03)N	5	300	3000	B1	3300	1250	25
94	(Ti0.2Cr0.2Al0.57Y0.03)N	20	(Ti0.17Cr0.2Al0.5Si0.1Y0.03)N	20	75	3000	B1	3350	1250	20
95	(Ti0.2Cr0.2Al0.57Y0.03)N	50	(Ti0.17Cr0.2Al0.5Si0.1Y0.03)N	50	30	3000	B1	3350	1250	20
96	(Ti0.2Cr0.2Al0.57Y0.03)N	150	(Ti0.17Cr0.2Al0.5Si0.1Y0.03)N	150	10	3000	B1	3250	1250	25
97	(Ti0.2Cr0.2Al0.57Y0.03)N	200	(Ti0.17Cr0.2Al0.5Si0.1Y0.03)N	200	7	2800	B1	3200	1250	30
98	(Ti0.2Cr0.2Al0.57Y0.03)N	300	(Ti0.17Cr0.2Al0.5Si0.1Y0.03)N	300	5	3000	B1	3150	1250	35
99	(Ti0.2Cr0.2Al0.57Y0.03)N	30	(Ti0.17Cr0.2Al0.5Si0.1Y0.03)N	30	50	3000	B1	3250	1250	20
100	(Ti0.5Al0.5)N	1500	(Ti0.2Cr0.2Al0.57Y0.03)N	1500	1	3000	B1	3200	1150	40
101	(Ti0.25Cr0.1Al0.65)N	2000	(Ti0.2Cr0.2Al0.57Y0.03)N	1000	1	3000	B1	3250	1200	35
102	(Nbl0.15Cr0.25Al0.6)N	20	(Ti0.17Cr0.2Al0.5Si0.1Y0.03)N	20	75	3000	B4	3300	1250	25

Claims

1. A hard film having excellent oxidation resistance, consisting of:

(M)_aCr_bAl_cSi_dB_eY_fZ (however, M is at least one element selected from a group 4B element, a group 5B element, and a group 6B element (except for Cr) in the periodic table, and Z shows one of N, CN, NO and CNO), wherein

0<a≤0.3, 0.05≤b≤0.4, 0.4≤c≤0.8, 0≤d≤0.2, 0≤e≤0.2, and 0.01≤f≤0.1, and d ≥ 0.03 and/or e ≥ 0.03, (a, b, c, d, e and f show atomic ratios of M, Cr, Al, Si, B and Y respectively).

2. A hard film having excellent oxidation resistance, consisting of:

Cr_bAl_cSi_dB_eY_fZ (however, Z shows one of N, CN, NO and CNO), wherein

and
0.2≤b≤0.5, 0.4≤c≤0.7, 0≤d≤0.2, 0≤e≤0.2, and 0.01≤f≤0.1 (however, d+e>0),
(b, c, d, e and f show atomic ratios of Cr, Al, Si, B and Y respectively).

3. A hard film:
wherein hard films according to claim 1 or 2 are alternately stacked with compositions being different from each other, and
thickness of each layer is between 5 nm and 200 nm.

4. A method of manufacturing a hard film:
wherein when the hard film according to claim 1 or 2 is manufactured, the hard film is formed by a cathode discharge arc ion plating method.

Ansprüche

1. Hartfilm mit hervorragender Oxidationsbeständigkeit, bestehend aus:

(M)_aCr_bAl_cSi_dB_eY_fZ (jedoch, M ist mindestens ein Element, ausgewählt aus einem Gruppe 4B-Element, einem Gruppe 5B-Element und einem Gruppe 6B-Element (außer Cr) in dem Periodensystem, und Z zeigt eines von N, CN, NO und CNO), wobei


0<a≤0,3, 0,05≤b≤0,4, 0,4≤c≤0,8, 0≤d≤0,2, 0≤e≤0,2 und 0,01≤f≤0,1 und d≥0,03 und/oder e≥0,03,
(a, b, c, d, e und f zeigen Atomverhältnisse von M, Cr, Al, Si, B bzw. Y).

2. Hartfilm mit hervorragender Oxidationsbeständigkeit, bestehend aus:

Cr_bAl_cSi_dB_eY_fZ (jedoch, Z zeigt eines von N, CN, NO und CNO), wobei

und
0,2≤b≤0,5, 0,4≤c≤0,7, 0≤d≤0,2, 0≤e≤0,2 und 0,01≤f≤0,1 (jedoch, d+e>0),
(b, c, d, e und f zeigen Atomverhältnisse von Cr, Al, Si, B bzw. Y).

3. Hartfilm, wobei Hartfilme nach Anspruch 1 oder 2 alternierend mit voneinander unterschiedlichen Zusammensetzungen übereinander geschichtet sind, und die Dicke jeder Schicht zwischen 5 nm und 200 nm beträgt.

4. Verfahren zur Herstellung eines Hartfilms, wobei, wenn der Hartfilm nach Anspruch 1 oder 2 hergestellt wird, der Hartfilm durch ein Bogenkathodenentladungsionenplattierungsverfahren gebildet wird.

Revendications

1. Film rigide doté d'une excellente résistance à l'oxydation, constitué de :

(M)_aCr_bAl_cSi_dB_eY_fZ (cependant, M est au moins un élément choisi parmi un élément du groupe 4B, un élément du groupe 5B et un élément du groupe 6B (excepté pour Cr) dans le tableau périodique, et Z indique l'un du N, CN, NO et CNO), dans lequel


0<a≤0.3, 0.05≤b≤0.4, 0.4≤c≤.8, 0≤d≤0.2, 0≤e≤0.2, et 0.01≤f≤0.1, et d≥0.03 et/ou e≥0,03 (a, b, c, d, e et f indiquent respectivement des rapports atomiques de M, Cr, Al, Si, B et Y).

2. Film rigide doté d'une excellente résistance à l'oxydation, constitué de :

Cr_bAl_cSi_dB_eY_fZ (cependant, Z indique l'un du N, CN, NO et CNO), dans lequel

et
0.2≤b≤0.5, 0.4≤c≤0.7, 0≤d≤0.2, 0≤e≤0.2, et 0.01≤f≤0.1 (cependant, d+e>0),
(b, c, d, e et f indiquent respectivement des rapports atomiques de Cr, Al, Si, B et Y).

3. Film rigide :

dans lequel des films rigides selon la revendication 1 ou 2 sont empilés en alternance avec des compositions différentes les unes des autres, et

l'épaisseur de chaque couche est comprise entre 5 nm et 200 nm.

4. Procédé de fabrication d'un film rigide :

dans lequel, lorsque le film rigide selon la revendication 1 ou 2 est fabriqué, le film rigide est réalisé par un procédé de placage ionique à l'arc à décharge cathodique.

Drawing