<?xml version="1.0" encoding="UTF-8"?>
<!DOCTYPE ep-patent-document PUBLIC "-//EPO//EP PATENT DOCUMENT 1.4//EN" "ep-patent-document-v1-4.dtd">
<ep-patent-document id="EP06781429B8W1" file="EP06781429W1B8.xml" lang="en" country="EP" doc-number="1911805" kind="B8" correction-code="W1" date-publ="20120704" status="c" dtd-version="ep-patent-document-v1-4">
<SDOBI lang="en"><B000><eptags><B001EP>ATBECHDEDKESFRGBGRITLILUNLSEMCPTIESILTLVFIRO..CY..TRBGCZEEHUPLSK....IS..............................</B001EP><B005EP>J</B005EP><B007EP>DIM360 Ver 2.15 (14 Jul 2008) -  2999001/0</B007EP><B070EP>The file contains technical information submitted after the application was filed and not included in this specification</B070EP></eptags></B000><B100><B110>1911805</B110><B120><B121>CORRECTED EUROPEAN PATENT SPECIFICATION</B121></B120><B130>B8</B130><B132EP>B1</B132EP><B140><date>20120704</date></B140><B150><B151>W1</B151><B153>72</B153><B155><B1551>de</B1551><B1552>Bibliographie</B1552><B1551>en</B1551><B1552>Bibliography</B1552><B1551>fr</B1551><B1552>Bibliographie</B1552></B155></B150><B190>EP</B190></B100><B200><B210>06781429.3</B210><B220><date>20060721</date></B220><B240><B241><date>20080222</date></B241><B242><date>20090714</date></B242></B240><B250>ja</B250><B251EP>en</B251EP><B260>en</B260></B200><B300><B310>2005212537</B310><B320><date>20050722</date></B320><B330><ctry>JP</ctry></B330></B300><B400><B405><date>20120704</date><bnum>201227</bnum></B405><B430><date>20080416</date><bnum>200816</bnum></B430><B450><date>20120418</date><bnum>201216</bnum></B450><B452EP><date>20111206</date></B452EP><B480><date>20120704</date><bnum>201227</bnum></B480></B400><B500><B510EP><classification-ipcr sequence="1"><text>C08L  51/06        20060101AFI20111026BHEP        </text></classification-ipcr><classification-ipcr sequence="2"><text>C08F   8/22        20060101ALI20111026BHEP        </text></classification-ipcr><classification-ipcr sequence="3"><text>C08J   3/05        20060101ALI20111026BHEP        </text></classification-ipcr></B510EP><B540><B541>de</B541><B542>WÄSSRIGE HARZZUSAMMENSETZUNG UND HERSTELLUNGSVERFAHREN DAFÜR</B542><B541>en</B541><B542>AQUEOUS RESIN COMPOSITION AND METHOD FOR PRODUCING SAME</B542><B541>fr</B541><B542>COMPOSITION DE RÉSINE AQUEUSE ET PROCÉDÉ SERVANT À PRODUIRE CELLE-CI</B542></B540><B560><B561><text>EP-A- 1 354 911</text></B561><B561><text>DE-A1- 10 056 264</text></B561><B561><text>JP-A- 03 182 534</text></B561><B561><text>JP-A- 10 231 402</text></B561><B561><text>JP-A- 10 298 233</text></B561><B561><text>JP-A- 2003 327 761</text></B561><B561><text>JP-A- 2005 036 076</text></B561><B565EP><date>20090325</date></B565EP></B560></B500><B700><B720><B721><snm>KASHIHARA, Kenji</snm><adr><str>KASEI KOGYO CO., LTD.
2900, Sone-cho</str><city>Takasago-shi, Hyogo 6760082</city><ctry>JP</ctry></adr></B721><B721><snm>MATSUOKA, Hideo</snm><adr><str>KASEI KOGYO CO., LTD.
2900, Sone-cho</str><city>Takasago-shi, Hyogo 6760082</city><ctry>JP</ctry></adr></B721></B720><B730><B731><snm>Toyo Boseki Kabushiki Kaisha</snm><iid>100733384</iid><irf>90038EP</irf><adr><str>2-8, Dojimahama 2-chome, 
Kita-ku</str><city>Osaka-shi, Osaka 530-8230</city><ctry>JP</ctry></adr></B731></B730><B740><B741><snm>Hock, Joachim</snm><sfx>et al</sfx><iid>100046843</iid><adr><str>Müller-Boré &amp; Partner 
Grafinger Strasse 2</str><city>81671 München</city><ctry>DE</ctry></adr></B741></B740></B700><B800><B840><ctry>AT</ctry><ctry>BE</ctry><ctry>BG</ctry><ctry>CH</ctry><ctry>CY</ctry><ctry>CZ</ctry><ctry>DE</ctry><ctry>DK</ctry><ctry>EE</ctry><ctry>ES</ctry><ctry>FI</ctry><ctry>FR</ctry><ctry>GB</ctry><ctry>GR</ctry><ctry>HU</ctry><ctry>IE</ctry><ctry>IS</ctry><ctry>IT</ctry><ctry>LI</ctry><ctry>LT</ctry><ctry>LU</ctry><ctry>LV</ctry><ctry>MC</ctry><ctry>NL</ctry><ctry>PL</ctry><ctry>PT</ctry><ctry>RO</ctry><ctry>SE</ctry><ctry>SI</ctry><ctry>SK</ctry><ctry>TR</ctry></B840><B860><B861><dnum><anum>JP2006314507</anum></dnum><date>20060721</date></B861><B862>ja</B862></B860><B870><B871><dnum><pnum>WO2007011033</pnum></dnum><date>20070125</date><bnum>200704</bnum></B871></B870><B880><date>20080416</date><bnum>200816</bnum></B880></B800></SDOBI>
</ep-patent-document>
