Carbon Filament Memory and Fabrication Method

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(11)

EP 1 916 722 A3

(12)	EUROPEAN PATENT APPLICATION

(88)	Date of publication A3:
	19.01.2011 Bulletin 2011/03

(43)	Date of publication A2:
	30.04.2008 Bulletin 2008/18

(21)	Application number: 07119159.7

(22)	Date of filing: 24.10.2007

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International Patent Classification (IPC):

H01L 45/00^(2006.01)

(84)	Designated Contracting States:
	AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC MT NL PL PT RO SE SI SK TR
	Designated Extension States:
	AL BA HR MK RS

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Priority:

27.10.2006 US 588864
20.02.2007 US 708757

(71)	Applicant: Qimonda AG
	81739 München (DE)

(72)	Inventors:
	Kreupl, Franz 80802, München (DE) Kund, Michael 83104, Tuntenhausen (DE) Ufert, Klaus-Dieter 85716, Unterschleissheim (DE)

(74)	Representative: Viering, Jentschura & Partner
	Postfach 22 14 43 80504 München 80504 München (DE)

(54)	Carbon Filament Memory and Fabrication Method

(57) An integrated circuit is described, including a memory element including a first carbon layer rich in a first carbon material and a second carbon layer rich in a second carbon material. The memory element stores information by reversibly forming a conductive channel in the second carbon layer, wherein the conductive channel includes the first carbon material.

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