(19)
(11) EP 1 921 477 A8

(12) CORRECTED EUROPEAN PATENT APPLICATION
Note: Bibliography reflects the latest situation

(15) Correction information:
Corrected version no 1 (W1 A2)

(48) Corrigendum issued on:
09.06.2010 Bulletin 2010/23

(88) Date of publication A3:
04.06.2008 Bulletin 2008/23

(43) Date of publication:
14.05.2008 Bulletin 2008/20

(21) Application number: 08101041.5

(22) Date of filing: 13.06.2006
(51) International Patent Classification (IPC): 
F21V 29/00(2006.01)
A61B 18/22(2006.01)
 F21K 7/00(2006.01)
G02B 6/42(2006.01)
(84) Designated Contracting States:
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR

(30) Priority: 13.06.2005 JP 2005172220
08.05.2006 JP 2006129332

(62) Application number of the earlier application in accordance with Art. 76 EPC:
06253028.2 / 1734302

(71) Applicant: Nichia Corporation
Anan-shi, Tokushima 774-8601 (JP)

(72) Inventors:
  • Hama, Atsutomo
    Anan-shi Tokushima 774-8601 (JP)
  • Hayashi, Yukihiro
    Anan-shi Tokushima 774-8601 (JP)

(74) Representative: Fenlon, Christine Lesley 
Haseltine Lake LLP Lincoln House, 5th Floor 300 High Holborn
London WC1V 7JH
London WC1V 7JH (GB)

 
Remarks:
This application was filed on 29-01-2008 as a divisional application to the application mentioned under INID code 62.
 


(54) A light emitting device


(57) In a light emitting device comprising a light emitting element (10), a wavelength conversion member (40) for converting the wavelength of light from the light emitting element (10), a bendable light guide member (20) for guiding light from the light emitting element (10) to the wavelength conversion member (40), a heat conduction member (50) thermally connected to the wavelength conversion member (40), and a covering member (60) that covers the side face of the emission-side end of the light guide member (20), the heat conduction member (50) is composed of a metal film formed on the entire surface of the covering member (60).