(19)

(11)

EP 1 929 694 A2

(12)

(88) Date of publication A3: 21.06.2007 (43) Date of publication: 11.06.2008 Bulletin 2008/24 (21) Application number: 06815515.9 (22) Date of filing: 26.09.2006

(51) International Patent Classification (IPC):  H04L 1/24(2006.01) H04L 1/20(2006.01) H04L 27/26(2006.01) (86) International application number: PCT/US2006/037568 (87) International publication number: WO 2007/038554 (05.04.2007 Gazette 2007/14)

(84) Designated Contracting States: AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR (30) Priority: 27.09.2005 US 721372 P 22.02.2006 US 361085 (71) Applicant: QUALCOMM Incorporated San Diego CA 92121 (US)	(72) Inventors: LING, Fuyun California 92127 (US) VAN VEEN, Durk, L. California 92071 (US) CHARI, Murali, Ramaswamy California 92128 (US) SUN, Thomas California 92127 (US) (74) Representative: Lane, Cathal Michael et al c/o Tomkins & Co. 5 Dartmouth Road Dublin 6 Dublin 6 (IE)