<?xml version="1.0" encoding="UTF-8"?>
<!DOCTYPE ep-patent-document PUBLIC "-//EPO//EP PATENT DOCUMENT 1.4//EN" "ep-patent-document-v1-4.dtd">
<ep-patent-document id="EP06825325B8W1" file="EP06825325W1B8.xml" lang="en" country="EP" doc-number="1931840" kind="B8" correction-code="W1" date-publ="20120215" status="c" dtd-version="ep-patent-document-v1-4">
<SDOBI lang="en"><B000><eptags><B001EP>ATBECHDEDKESFRGBGRITLILUNLSEMCPTIESILTLVFIRO..CY..TRBGCZEEHUPLSK....IS..............................</B001EP><B003EP>*</B003EP><B005EP>J</B005EP><B007EP>DIM360 Ver 2.15 (14 Jul 2008) -  2999001/0</B007EP></eptags></B000><B100><B110>1931840</B110><B120><B121>CORRECTED EUROPEAN PATENT SPECIFICATION</B121></B120><B130>B8</B130><B132EP>B1</B132EP><B140><date>20120215</date></B140><B150><B151>W1</B151><B153>84</B153><B155><B1551>de</B1551><B1552>Bibliographie</B1552><B1551>en</B1551><B1552>Bibliography</B1552><B1551>fr</B1551><B1552>Bibliographie</B1552></B155></B150><B190>EP</B190></B100><B200><B210>06825325.1</B210><B220><date>20061003</date></B220><B240><B241><date>20080313</date></B241><B242><date>20100601</date></B242></B240><B250>en</B250><B251EP>en</B251EP><B260>en</B260></B200><B300><B310>723578 P</B310><B320><date>20051004</date></B320><B330><ctry>US</ctry></B330><B310>733686 P</B310><B320><date>20051104</date></B320><B330><ctry>US</ctry></B330><B310>432873</B310><B320><date>20060512</date></B320><B330><ctry>US</ctry></B330></B300><B400><B405><date>20120215</date><bnum>201207</bnum></B405><B430><date>20080618</date><bnum>200825</bnum></B430><B450><date>20110907</date><bnum>201136</bnum></B450><B452EP><date>20110314</date></B452EP><B480><date>20120215</date><bnum>201207</bnum></B480></B400><B500><B510EP><classification-ipcr sequence="1"><text>E04B   2/08        20060101AFI20080730BHEP        </text></classification-ipcr></B510EP><B540><B541>de</B541><B542>MODULARE ANORDUNG ZUR FUSSBODENVERLEGUNG</B542><B541>en</B541><B542>MODULAR FLOORING ASSEMBLIES</B542><B541>fr</B541><B542>ENSEMBLE DE REVÊTEMENT DE SOL MODULAIRE</B542></B540><B560><B561><text>EP-A- 1 146 182</text></B561><B561><text>WO-A-03/040491</text></B561><B561><text>DE-A1- 19 962 812</text></B561><B561><text>US-A- 4 167 599</text></B561><B561><text>US-A- 4 917 532</text></B561><B561><text>US-A- 5 616 389</text></B561><B561><text>US-B1- 6 802 159</text></B561><B561><text>US-B2- 6 751 912</text></B561><B561><text>US-B2- 7 114 298</text></B561><B565EP><date>20090513</date></B565EP></B560></B500><B700><B720><B721><snm>MCINTOSH, Jonathan</snm><adr><str>4739 South 167th Street</str><city>Omaha, Nebraska 68135</city><ctry>US</ctry></adr></B721><B721><snm>SPERLING, Nicole, C.</snm><adr><str>1621 SW 36th St.</str><city>Lincoln, NE68522</city><ctry>US</ctry></adr></B721></B720><B730><B731><snm>COMC LLC</snm><iid>100967891</iid><irf>132 970</irf><adr><str>4739 South 167th Street</str><city>Omaha, NE 68135</city><ctry>US</ctry></adr></B731></B730><B740><B741><snm>HOFFMANN EITLE</snm><iid>100061036</iid><adr><str>Patent- und Rechtsanwälte 
Arabellastraße 4</str><city>81925 München</city><ctry>DE</ctry></adr></B741></B740></B700><B800><B840><ctry>AT</ctry><ctry>BE</ctry><ctry>BG</ctry><ctry>CH</ctry><ctry>CY</ctry><ctry>CZ</ctry><ctry>DE</ctry><ctry>DK</ctry><ctry>EE</ctry><ctry>ES</ctry><ctry>FI</ctry><ctry>FR</ctry><ctry>GR</ctry><ctry>HU</ctry><ctry>IE</ctry><ctry>IS</ctry><ctry>IT</ctry><ctry>LI</ctry><ctry>LT</ctry><ctry>LU</ctry><ctry>LV</ctry><ctry>MC</ctry><ctry>NL</ctry><ctry>PL</ctry><ctry>PT</ctry><ctry>RO</ctry><ctry>SE</ctry><ctry>SI</ctry><ctry>SK</ctry><ctry>TR</ctry></B840><B860><B861><dnum><anum>US2006038379</anum></dnum><date>20061003</date></B861><B862>en</B862></B860><B870><B871><dnum><pnum>WO2007044293</pnum></dnum><date>20070419</date><bnum>200716</bnum></B871></B870></B800></SDOBI>
</ep-patent-document>
