| (19) |
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(11) |
EP 1 944 332 A8 |
| (12) |
CORRECTED EUROPEAN PATENT APPLICATION |
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Note: Bibliography reflects the latest situation |
| (15) |
Correction information: |
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Corrected version no 1 (W1 A2) |
| (48) |
Corrigendum issued on: |
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30.06.2010 Bulletin 2010/26 |
| (88) |
Date of publication A3: |
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21.10.2009 Bulletin 2009/43 |
| (43) |
Date of publication: |
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16.07.2008 Bulletin 2008/29 |
| (22) |
Date of filing: 31.03.2000 |
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| (51) |
International Patent Classification (IPC):
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| (84) |
Designated Contracting States: |
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DE FR GB |
| (30) |
Priority: |
31.03.1999 JP 9103899
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| (62) |
Application number of the earlier application in accordance with Art. 76 EPC: |
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00913042.8 / 1179558 |
| (71) |
Applicants: |
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- National Institute of Advanced Industrial Science
and Technology
Tokyo 100-8921 (JP)
- DAINICHISEIKA COLOR
& CHEMICALS MFG. CO. LTD.
Chuo-ku,
Tokyo 103-8383 (JP)
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| (72) |
Inventors: |
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- Hiraga, Takashi
Ideka-shi
Osaka 563-8577 (JP)
- Moriya, Tetsuo
Amagasaki-shi
Hyogo 661-0974 (JP)
- Chen, Qiying
Tsukuba-city
Ibaraki 305-8562 (JP)
- Tominaga, Junji
Tsukuba-city
Ibaraki 305-8562 (JP)
- Atoda, Nobufumi
Tsukuba-city
Ibaraki 305-8562 (JP)
- Tanaka, N.
Dainichiseika C. & Chem. Mfg. Co., Ltd.
Tokyo 103-8383 (JP)
- Yanagimoto, H.
Dainichiseika C. & Mfg. Co., Ltd.
Tokyo 103-8383 (JP)
- Ueno, Ichiro
ictor Company of Japan, Ltd.
Yokohoma-shi
Kanagawa 221-8528 (JP)
- Tsujita, Koji
Victor Company of Japan, Ltd.
Yokohama-shi
Kanagawa 221-8528 (JP)
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| (74) |
Representative: HOFFMANN EITLE |
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Patent- und Rechtsanwälte
Arabellastrasse 4
81925 München
81925 München (DE) |
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Remarks: |
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This application was filed on 15-04-2008 as a divisional application to the application
mentioned under INID code 62. |
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| (54) |
Method of modifying surface layer of molded resin |
(57) A modification method of the surface layer of a molded resin article which comprises
the steps of:
placing, in a first closed space, an organic compound having sublimation properties
and an affinity for a resin of a molded resin article to be coated;
on the other hand, placing the molded resin article in a second closed space;
controlling a temperature in the second closed space so as to be equal to or higher
than the temperature in the first closed space;
bringing a pressure in the first closed space to a saturated sublimation pressure
state of the organic compound;
controlling a pressure in the second closed space so as to be equal to or lower than
the pressure in the first closed space;
subsequently, connecting the first closed space to the second closed space to form
a third closed space in which the first closed space is combined with the second closed
space, and further controlling the temperature and the pressure so that the whole
of the third closed space may be in the saturated sublimation pressure state of the
organic compound;
allowing a vapor of the organic compound with which the first closed space before
the connection is filled to diffuse into the second closed space before the connection;
uniformly depositing the vapor of the organic compound on the surface of the molded
resin article; and
allowing the deposited organic compound to penetrate/disperse from the surface of
the molded resin article into its inside.