(19)
(11) EP 1 949 440 A2

(12)

(88) Date of publication A3:
07.09.2007

(43) Date of publication:
30.07.2008 Bulletin 2008/31

(21) Application number: 06827158.4

(22) Date of filing: 30.10.2006
(51) International Patent Classification (IPC): 
H01L 23/495(2006.01)
(86) International application number:
PCT/US2006/042450
(87) International publication number:
WO 2007/053606 (10.05.2007 Gazette 2007/19)
(84) Designated Contracting States:
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR

(30) Priority: 01.11.2005 US 264112
01.11.2005 US 264556

(71) Applicant: SanDisk Corporation
Milpitas, CA 95935 (US)

(72) Inventor:
  • WALLACE, Robert, F.
    Ft. Myers, FL 33912 (US)

(74) Representative: Tothill, John Paul 
Frank B. Dehn & Co. St Bride's House 10 Salisbury Square
London EC4Y 8JD
London EC4Y 8JD (GB)

   


(54) MULTIPLE DIE INTEGRATED CIRCUIT PACKAGE