(19)
(11) EP 1 971 699 A2

(12)

(88) Date of publication A3:
10.04.2008

(43) Date of publication:
24.09.2008 Bulletin 2008/39

(21) Application number: 07716333.5

(22) Date of filing: 05.01.2007
(51) International Patent Classification (IPC): 
C22C 13/00(2006.01)
B23K 35/26(2006.01)
(86) International application number:
PCT/US2007/000226
(87) International publication number:
WO 2007/081775 (19.07.2007 Gazette 2007/29)
(84) Designated Contracting States:
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
Designated Extension States:
AL BA HR MK RS

(30) Priority: 10.01.2006 US 757721 P
23.01.2006 US 761400 P
02.03.2006 US 366523

(71) Applicant: Illinois Tool Works Inc.
Glenview, IL 60026 (US)

(72) Inventor:
  • DERAM, Brian, T.
    Glenview, IL 60026 (US)

(74) Representative: Finnie, Peter John 
Gill Jennings & Every LLP Broadgate House 7 Eldon Street
London EC2M 7LH
London EC2M 7LH (GB)

   


(54) LEAD-FREE SOLDER WITH LOW COPPER DISSOLUTION