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(11) | EP 1 979 757 B8 |
| (12) | CORRECTED EUROPEAN PATENT SPECIFICATION |
| Note: Bibliography reflects the latest situation |
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AN INTEGRATED CIRCUIT PACKAGE, AND A METHOD FOR PRODUCING AN INTEGRATED CIRCUIT PACKAGE HAVING TWO DIES WITH INPUT AND OUTPUT TERMINALS OF INTEGRATED CIRCUITS OF THE DIES DIRECTLY ADDRESSABLE FOR TESTING OF THE PACKAGE INTEGRIERTES SCHALTUNGSPAKET UND VERFAHREN ZUR HERSTELLUNG EINES INTEGRIERTEN SCHALTUNGSPAKETS MIT ZWEI MATRIZEN MIT EINGANGS- UND AUSGANGSKLEMMEN FÜR INTEGRIERTE SCHALTUNGEN DER MATRIZEN ZUM TESTEN DES PAKETS BOITIER DE CIRCUITS INTEGRES, ET PROCEDE DE FABRICATION D'UN BOITIER DE CIRCUITS INTEGRES COMPORTANT DEUX PUCES DONT LES CIRCUITS INTEGRES POSSEDENT DES BORNES D'ENTREE ET DE SORTIE DIRECTEMENT ADRESSABLES POUR PERMETTRE LE CONTROLE DU BOITIER |
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| Note: Within nine months from the publication of the mention of the grant of the European patent, any person may give notice to the European Patent Office of opposition to the European patent granted. Notice of opposition shall be filed in a written reasoned statement. It shall not be deemed to have been filed until the opposition fee has been paid. (Art. 99(1) European Patent Convention). |