| (19) |
 |
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(11) |
EP 2 009 142 A8 |
| (12) |
CORRECTED EUROPEAN PATENT APPLICATION |
|
published in accordance with Art. 153(4) EPC |
| (15) |
Correction information: |
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Corrected version no 1 (W1 A1) |
| (48) |
Corrigendum issued on: |
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15.04.2009 Bulletin 2009/16 |
| (43) |
Date of publication: |
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31.12.2008 Bulletin 2009/01 |
| (22) |
Date of filing: 02.03.2007 |
|
| (51) |
International Patent Classification (IPC):
|
| (86) |
International application number: |
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PCT/JP2007/054032 |
| (87) |
International publication number: |
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WO 2007/122869 (01.11.2007 Gazette 2007/44) |
|
| (84) |
Designated Contracting States: |
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DE FR GB |
| (30) |
Priority: |
18.04.2006 JP 2006114229
|
| (71) |
Applicant: OKUNO CHEMICAL INDUSTRIES CO., LTD. |
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Osaka-shi
Osaka 541 (JP) |
|
| (72) |
Inventors: |
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- SATOU, Kazuya
Osaka-shi, Osaka 538-0044 (JP)
- YOSHIKANE, Yusuke
Osaka-shi, Osaka 538-0044 (JP)
|
| (74) |
Representative: Müller-Boré & Partner
Patentanwälte |
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Grafinger Strasse 2
81671 München
81671 München (DE) |
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| |
|
| (54) |
COMPOSITION FOR ETCHING TREATMENT OF RESIN MOLDED ARTICLE |
(57) The present invention provides a composition for the etching treatment of a resin
molded article. The composition is composed of an aqueous solution containing 20 to
1,200 g/l of an inorganic acid, 0.01 to 10 g/l of a manganese salt, and 1 to 200 g/l
of at least one component selected from the group consisting of halogen oxoacids,
halogen oxoacid salts, persulfate salts, and bismuthate salts.
The etching composition of the invention is a novel etching solution capable of forming
a plating film having a good adhesion to various resin molded articles made of ABS
resins or the like, and can be used in place of chromic acid mixtures. The composition
is highly safe so that the liquid waste is easily disposed of.