(19)
(11) EP 2 009 968 A8

(12) CORRECTED EUROPEAN PATENT APPLICATION
published in accordance with Art. 153(4) EPC

(15) Correction information:
Corrected version no 1 (W1 A1)

(48) Corrigendum issued on:
18.03.2009 Bulletin 2009/12

(43) Date of publication:
31.12.2008 Bulletin 2009/01

(21) Application number: 08720606.6

(22) Date of filing: 26.03.2008
(51) International Patent Classification (IPC): 
H05K 1/02(2006.01)
 H05K 7/20(2006.01)
(86) International application number:
PCT/JP2008/000727
(87) International publication number:
WO 2008/129831 (30.10.2008 Gazette 2008/44)
(84) Designated Contracting States:
DE FR GB

(30) Priority: 30.03.2007 JP 2007093238
10.04.2007 JP 2007102425

(71) Applicant: Panasonic Corporation
Kadoma-shi Osaka 571-8501 (JP)

(72) Inventors:
  • ASAHI, Toshiyuki c/o Panasonic Corporation IPROC
    Osaka-shi, Osaka 540-6207 (JP)
  • SHIMASAKI, Yukihiro c/o Panasonic Corporation IPROC
    Osaka-shi, Osaka 540-6207 (JP)
  • ECHIGO, Fumio c/o Panasonic Corporation IPROC
    Osaka-shi, Osaka 540-6207 (JP)

(74) Representative: Grünecker, Kinkeldey, Stockmair & Schwanhäusser Anwaltssozietät 
Leopoldstrasse 4
80802 München
80802 München (DE)

   


(54) WIRING BOARD


(57) A wiring board includes an insulating board having a top surface arranged to have an electronic component mounted thereto, a conductor pattern formed on the top surface of the insulating board, and a heat emitting layer made of heat-emitting material covering the conductor pattern. The heat-emitting material has an emissivity not less than 0.8 for an electromagnetic wave having a wavelength λ = 0.002898/T at a temperature T ranging from 293K to 473K. This wiring board suppresses the temperature rise of the electronic component.