| (19) |
 |
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(11) |
EP 2 017 373 A3 |
| (12) |
EUROPEAN PATENT APPLICATION |
| (88) |
Date of publication A3: |
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11.09.2013 Bulletin 2013/37 |
| (43) |
Date of publication A2: |
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21.01.2009 Bulletin 2009/04 |
| (22) |
Date of filing: 21.07.2008 |
|
| (51) |
International Patent Classification (IPC):
|
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| (84) |
Designated Contracting States: |
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AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL
PT RO SE SI SK TR |
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Designated Extension States: |
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AL BA MK RS |
| (30) |
Priority: |
20.07.2007 US 961393 P
|
| (71) |
Applicant: Rohm and Haas Electronic Materials LLC |
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Marlborough, MA 01752 (US) |
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| (72) |
Inventors: |
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- Zhang-Beglinger, Wan
6043 Adiigenswil (CH)
- Clauss, Margit
6010 Kriens (CH)
- Schwager, Felix J
6045 Meggen (CH)
- Guebey, Jonas
6010 Kriens (CH)
|
| (74) |
Representative: Buckley, Guy Julian |
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Patent Outsourcing Limited
1 King Street
Bakewell
Derbyshire DE45 1DZ
Derbyshire DE45 1DZ (GB) |
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| |
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| (54) |
High speed method for plating palladium and palladium alloys |
(57) A high speed method of depositing palladium and palladium alloys is disclosed. The
high speed method uses an aqueous, ammonia-based bath which has reduced free ammonia
in the bath. The high speed method may be used to deposit palladium and palladium
alloy coatings on various substrates such as electrical devices and jewelry.