Multiple-axis sensor package and method of assembly

(19)

(11)

EP 2 034 321 A3

(12)	EUROPEAN PATENT APPLICATION

(88)	Date of publication A3:
	18.11.2009 Bulletin 2009/47

(43)	Date of publication A2:
	11.03.2009 Bulletin 2009/11

(21)	Application number: 08162957.8

(22)	Date of filing: 26.08.2008

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International Patent Classification (IPC):

G01P 1/02^(2006.01)

G01P 15/18^(2006.01)

(84)	Designated Contracting States:
	AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR
	Designated Extension States:
	AL BA MK RS

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Priority:

05.09.2007 US 899353

(71)	Applicant: Delphi Technologies, Inc.
	Troy, Michigan 48007 (US)

(72)	Inventors:
	Cluff, Charles A. Zionsville, IN 46077 (US) Cheng, Chean F. 730608, Singapore (SG) Chan, Aik Huang 546589, Singapore (SG) Chua, Sze Lam 760155, Singapore (SG)

(74)	Representative: Denton, Michael John et al
	Delphi France SAS 64 Avenue de la Plaine de France ZAC Paris Nord II B.P. 65059, Tremblay en France 95972 Roissy Charles de Gaulle Cedex 95972 Roissy Charles de Gaulle Cedex (FR)

(54)	Multiple-axis sensor package and method of assembly

(57) A multiple-axis sensor package (20) and method of assembling a multiple-axis sensor package (20) arc provided. The package (20) includes a first substrate (30) having a first accelerometer (32) for sensing acceleration (A_x) in a first sensing axis (X-axis). The package (20) also includes a second substrate (40) having a second accelerometer (42) for sensing acceleration (A_y) in a second sensing axis (Y-axis). The package (20) further includes one or more bent lead connectors (90) connecting the first substrate (30) to the second substrate (40), wherein the one or more bent lead connectors (90) are bent so that the first sensing axis (X-axis) is different than the second sensing axis (Y-axis).

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