STACKABLE IC PACKAGE WITH TOP AND BOTTOM INTERCONNECT - Patent 2036127

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EP 2 036 127 A1

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(43)	Date of publication:
	18.03.2009 Bulletin 2009/12

(21)	Application number: 06765775.9

(22)	Date of filing: 16.06.2006

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International Patent Classification (IPC):

H01L 25/10^(2006.01)
H01L 23/498^(2006.01)

H01L 23/31^(2006.01)

(86)	International application number:
	PCT/IB2006/051946

(87)	International publication number:
	WO 2007/148154 (27.12.2007 Gazette 2007/52)

(84)	Designated Contracting States:
	AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR
	Designated Extension States:
	AL BA HR MK RS

(71)	Applicant: Koninklijke Philips Electronics N.V.
	5621 BA Eindhoven (NL)

(72)	Inventor:
	WEEKAMP, Johannus, Wilhelmus 5621 BA Eindhoven (NL)

(74)	Representative: Van Velzen, Maaike Mathilde
	Philips Intellectual Property & Standards P.O. Box 220 5600 AE Eindhoven 5600 AE Eindhoven (NL)

(54)	STACKABLE IC PACKAGE WITH TOP AND BOTTOM INTERCONNECT