(19)
(11) EP 2 051 569 A3

(12) EUROPEAN PATENT APPLICATION

(88) Date of publication A3:
17.02.2010 Bulletin 2010/07

(43) Date of publication A2:
22.04.2009 Bulletin 2009/17

(21) Application number: 08166516.8

(22) Date of filing: 13.10.2008
(51) International Patent Classification (IPC): 
H05K 1/02(2006.01)
(84) Designated Contracting States:
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR
Designated Extension States:
AL BA MK RS

(30) Priority: 17.10.2007 US 874103

(71) Applicant: Honeywell International Inc.
Morristown, NJ 07962 (US)

(72) Inventors:
  • Patten, Charles B.
    Sammamish, WA 98074 (US)
  • Vacanti, David C.
    Renton, WA 98058 (US)

(74) Representative: Buckley, Guy Julian 
Patent Outsourcing Limited 1 King Street
Bakewell Derbyshire DE45 1DZ
Bakewell Derbyshire DE45 1DZ (GB)

   


(54) Laminated printed wiring board with controlled spurious rf emission capability/characteristics


(57) Printed wiring board for generally reducing electro-magnetic, capacitive and inductive cross coupling and cross talk in electrical circuits, electronic modules, and systems utilizing dissipative carbon layers residing between layers of conventional analog, digital, radio frequency (RF), or assemblies of mixed circuitry printed wiring constructions. Connection between layers by the use of insulated vias is possible when connection to the carbon layer is not desired.







Search report