(19)
(11) EP 2 064 738 A1

(12)

(43) Date of publication:
03.06.2009 Bulletin 2009/23

(21) Application number: 07826269.8

(22) Date of filing: 05.09.2007
(51) International Patent Classification (IPC): 
H01L 21/768(2006.01)
H01L 21/8242(2006.01)
(86) International application number:
PCT/IB2007/053576
(87) International publication number:
WO 2008/029360 (13.03.2008 Gazette 2008/11)
(84) Designated Contracting States:
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC MT NL PL PT RO SE SI SK TR
Designated Extension States:
AL BA HR MK RS

(30) Priority: 06.09.2006 EP 06300929

(71) Applicant: NXP B.V.
5656 AE Eindhoven (NL)

(72) Inventor:
  • DE-JONGHE, Véronique
    NL-5656 AG Eindhoven (NL)

(74) Representative: Röggla, Harald 
NXP Semiconductors Intellectual Property Department Gutheil-Schoder-Gasse 8-12
1101 Vienna
1101 Vienna (AT)

   


(54) MANUFACTURING A CONTACT STRUCTURE IN A SEMICONDUCTOR DEVICE