(19)
(11)
EP 2 064 738 A1
(12)
(43)
Date of publication:
03.06.2009
Bulletin 2009/23
(21)
Application number:
07826269.8
(22)
Date of filing:
05.09.2007
(51)
International Patent Classification (IPC):
H01L
21/768
(2006.01)
H01L
21/8242
(2006.01)
(86)
International application number:
PCT/IB2007/053576
(87)
International publication number:
WO 2008/029360
(
13.03.2008
Gazette 2008/11)
(84)
Designated Contracting States:
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC MT NL PL PT RO SE SI SK TR
Designated Extension States:
AL BA HR MK RS
(30)
Priority:
06.09.2006
EP 06300929
(71)
Applicant:
NXP B.V.
5656 AE Eindhoven (NL)
(72)
Inventor:
DE-JONGHE, Véronique
NL-5656 AG Eindhoven (NL)
(74)
Representative:
Röggla, Harald
NXP Semiconductors Intellectual Property Department Gutheil-Schoder-Gasse 8-12
1101 Vienna
1101 Vienna (AT)
(54)
MANUFACTURING A CONTACT STRUCTURE IN A SEMICONDUCTOR DEVICE