(19)
(11) EP 2 077 065 A1

(12)

(43) Date of publication:
08.07.2009 Bulletin 2009/28

(21) Application number: 07803139.0

(22) Date of filing: 31.08.2007
(51) International Patent Classification (IPC): 
H05K 7/20(2006.01)
H01L 23/482(2006.01)
 C09J 163/00(2006.01)
H05K 3/32(2006.01)
(86) International application number:
PCT/EP2007/059152
(87) International publication number:
WO 2008/037559 (03.04.2008 Gazette 2008/14)
(84) Designated Contracting States:
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC MT NL PL PT RO SE SI SK TR

(30) Priority: 30.09.2006 EP 06020667

(71) Applicant: Umicore AG & Co. KG
63457 Hanau-Wolfgang (DE)

(72) Inventors:
  • THOMAS, Muriel
    Singapore 148957 (SG)
  • SCHAACK, Klaus
    63785 Obernburg (DE)

   


(54) USE OF AN ADHESIVE COMPOSITION FOR DIE-ATTACHING HIGH POWER SEMICONDUCTORS