(19)
(11) EP 2 082 423 A1

(12)

(43) Date of publication:
29.07.2009 Bulletin 2009/31

(21) Application number: 06837754.8

(22) Date of filing: 16.11.2006
(51) International Patent Classification (IPC): 
H01L 23/48(2006.01)
H01L 21/60(2006.01)
(86) International application number:
PCT/US2006/044465
(87) International publication number:
WO 2008/060280 (22.05.2008 Gazette 2008/21)
(84) Designated Contracting States:
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR

(71) Applicant: Henkel AG & Co. KGaA
40589 Düsselsdorf (DE)

(72) Inventors:
  • KURIYAMA, Kenji
    Torrance, CA 90505 (US)
  • WOJTUSZEWSKI, Paul
    Cerritos, CA 90703 (US)

   


(54) BOARD ON CHIP PACKAGE AND PROCESS FOR MAKING SAME